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ST0510A Tungsten Zirconium Boride Sputtering Target, WZrB

Chemical Formula: W/Zr/B
Catalog Number: ST0510A
Purity: 99.7% – 99.999% (Customizable)
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tungsten Zirconium Boride (WZrB) sputtering targets are available in various purities, sizes, and configurations. Thin Film Materials (TFM) specializes in high-performance WZrB targets with precise composition control, competitive pricing, and tailored solutions for advanced thin-film deposition applications.

Tungsten Zirconium Boride Sputtering Target, WZrB Made by TFM Tungsten Zirconium Boride Sputtering Target, WZrB Made by TFM

Introduction

Tungsten Zirconium Boride (WZrB) Sputtering Targets are advanced ceramic targets used in thin film deposition processes for high-performance protective coatings, high-temperature materials, and advanced electronics. By combining tungsten, zirconium, and boron, this compound offers exceptional hardness, thermal stability, and chemical resistance, making it suitable for demanding environments where conventional coatings may fail.

In Physical Vapor Deposition (PVD) systems such as RF magnetron sputtering, WZrB sputtering targets enable the formation of ultra-hard and wear-resistant thin films with excellent structural stability. These films are widely investigated for applications in cutting tools, aerospace components, semiconductor equipment, and advanced tribological coatings.

Detailed Description

Tungsten Zirconium Boride Sputtering Targets are typically manufactured using high-purity tungsten, zirconium, and boron powders through advanced powder metallurgy techniques. Processes such as hot pressing, hot isostatic pressing (HIP), or spark plasma sintering (SPS) are commonly used to produce dense ceramic targets with uniform composition and stable microstructure.

The combination of tungsten and zirconium with boron produces a compound material that exhibits outstanding mechanical and thermal characteristics. These include:

  • Ultra-high hardness comparable to advanced ceramic coatings

  • Excellent wear resistance for tribological applications

  • High melting point and thermal stability

  • Strong resistance to oxidation and chemical corrosion

  • Good electrical conductivity compared to many ceramic materials

These properties allow WZrB thin films to perform effectively in extreme operating conditions, including high temperatures, high mechanical loads, and corrosive environments.

Because tungsten zirconium boride behaves as a ceramic-like material, deposition is commonly performed using RF magnetron sputtering to ensure stable plasma generation and controlled film growth. In some cases, DC sputtering may also be used if the target conductivity allows.

WZrB sputtering targets can be manufactured in circular discs, rectangular plates, or custom shapes compatible with various sputtering cathodes. For larger targets or high-power deposition systems, the targets may be bonded to copper backing plates using indium bonding or elastomer bonding to enhance heat dissipation and mechanical stability.

High-density targets help maintain stable sputtering rates, reduce particle generation, and improve thin film uniformity.

Applications

Thin films deposited from WZrB Sputtering Targets are used in several advanced technology sectors:

  • Ultra-hard protective coatings – wear-resistant coatings for cutting tools and industrial components.

  • High-temperature coatings – protective layers for aerospace and turbine components.

  • Semiconductor equipment coatings – durable coatings for vacuum chamber components.

  • Tribological coatings – low-friction, wear-resistant surfaces for mechanical systems.

  • Advanced ceramic thin films – experimental materials in materials science research.

  • Aerospace and defense applications – coatings that withstand extreme mechanical and thermal conditions.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.5% – 99.9%Higher purity improves coating performance and stability
Density≥95% theoreticalEnsures stable sputtering and consistent deposition
Diameter25 – 300 mm (custom)Compatible with various sputtering cathodes
Thickness3 – 6 mmInfluences sputtering rate and target lifetime
BondingCopper backing plate (optional)Improves heat transfer and structural stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Tungsten Zirconium Boride (WZrB)Ultra-hard and high-temperature stabilityProtective and tribological coatings
Tungsten Boride (WB)High hardness and wear resistanceCutting tools and protective coatings
Zirconium Diboride (ZrB₂)Excellent thermal conductivity and oxidation resistanceHigh-temperature coatings

FAQ

QuestionAnswer
Can WZrB sputtering targets be customized?Yes, target dimensions, density, and backing plate bonding can be customized to match specific sputtering systems.
Which sputtering method is recommended for WZrB targets?RF magnetron sputtering is typically used due to the ceramic-like nature of tungsten zirconium boride.
Are bonded targets available?Yes, WZrB targets can be indium-bonded or elastomer-bonded to copper backing plates for improved thermal management.
What substrates are compatible with WZrB thin films?Silicon wafers, steel substrates, ceramics, and other engineering materials are commonly used.
Which industries commonly use WZrB sputtering targets?Semiconductor manufacturing, aerospace materials research, cutting tool coatings, and advanced tribological coating industries.

Packaging

Our Tungsten Zirconium Boride Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control standards. Each target is vacuum-sealed and carefully packaged with protective cushioning materials to prevent contamination or mechanical damage during storage and transportation. Export-grade cartons or wooden crates are used to ensure safe international delivery.

Conclusion

The Tungsten Zirconium Boride (WZrB) Sputtering Target is a high-performance ceramic target designed for the deposition of ultra-hard, wear-resistant, and thermally stable thin films. Its combination of tungsten, zirconium, and boron provides exceptional durability and stability in extreme environments, making it an excellent choice for protective coatings, high-temperature applications, and advanced materials research.

With high purity, customizable dimensions, and reliable manufacturing processes, WZrB sputtering targets provide consistent performance for both research laboratories and industrial thin film deposition systems.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

WZrB Target 99.7% ø3"*6mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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