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ST0510A Tungsten Zirconium Boride Sputtering Target, WZrB

Chemical Formula: W/Zr/B
Catalog Number: ST0510A
Purity: 99.7% – 99.999% (Customizable)
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Tungsten Zirconium Boride (WZrB) sputtering targets are available in various purities, sizes, and configurations. Thin Film Materials (TFM) specializes in high-performance WZrB targets with precise composition control, competitive pricing, and tailored solutions for advanced thin-film deposition applications.

MSDS File

Tungsten Zirconium Boride (WZrB) Sputtering Target Description

Discover the exceptional performance of Tungsten Zirconium Boride (WZrB) Sputtering Targets, engineered for advanced thin-film deposition in cutting-edge industries. This page explores the superior qualities of WZrB alloys, offering unmatched durability and versatility for high-tech applications.

Tungsten: The Epitome of Strength

Tungsten (W), a refractory metal with the highest melting point of all elements (3,422°C), is renowned for its extreme hardness, thermal stability, and resistance to wear and corrosion. Tungsten sputtering targets are critical for applications requiring robust coatings, such as semiconductor diffusion barriers, wear-resistant surfaces, and high-temperature electronics.

Zirconium Boride: Synergy of Lightweight and Toughness

Zirconium Boride (ZrB), a ceramic compound, combines the refractory properties of zirconium with the hardness of boron. It exhibits exceptional thermal conductivity, oxidation resistance, and mechanical strength, making it ideal for aerospace, nuclear reactors, and ultra-high-temperature coatings.

Related Products: Tungsten Sputtering Target, Zirconium Boride Sputtering Target.

Tungsten Zirconium Boride Sputtering Target Specifications

SpecificationDetails
Material TypeTungsten Zirconium Boride (WZrB)
Chemical SymbolW/Zr/B
Color/AppearanceMetallic gray, solid
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″; Thick: 0.125″, 0.250″. Custom sizes available.
Purity99.7% (Standard), up to 99.999% on request.
PackingIndividually tagged, vacuum-sealed for quality control and safe shipping.

WZrB Sputtering Target Applications

  1. Wear-Resistant Coatings: Ideal for tools, molds, and mechanical components requiring extreme durability.

  2. Semiconductor Barriers: Used in diffusion barriers for integrated circuits and microelectronics.

  3. High-Temperature Films: Essential for aerospace and energy sectors due to thermal stability.

  4. Advanced Optics: Enhances reflective coatings and optical communication devices.

WZrB Sputtering Target Advantages

✅ Unmatched Hardness: Combines tungsten’s strength with ZrB’s oxidation resistance.
✅ Thermal Stability: Performs reliably in extreme environments (up to 2,000°C).
✅ Customizable: Tailored purities, sizes, and shapes to meet specific deposition needs.
✅ Innovation-Driven: Enables breakthroughs in nanotechnology, renewable energy, and defense.

Unlock the Potential of WZrB Sputtering Targets
Elevate your thin-film technology with our high-performance Tungsten Zirconium Boride targets. Contact us today for customized solutions that push the boundaries of material science.

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WZrB Target 99.7% ø3"*6mm

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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