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V74 Series: Rectangular Transfer Valve (Slit Valves) – Standard

Applications

  • Plasma Etch, CVD, Sputter Deposition
  • Manufacturing of solar panels
  • Semiconductor processing
  • LCD/flat panel processes
  • All other cluster vacuum systems
Features
  • Standards Compliance: Designed to meet semi-standard applications, including SEMI E21-94, SEMI E24-92, and SEMI E21.1-1296.
  • Innovative Actuation Technology: Incorporates a patented L-motion link and dual shifts that operate without springs in the actuator, allowing for quicker and smoother movements while minimizing vibration.
  • Enhanced Dust Protection: Features a dust seal located on the vacuum side of the bonnet flange, effectively preventing particles from entering the bellows.
  • Secure Positioning: The mechanical locking mechanism ensures that the valve remains securely in place at the end of its travel.
  • Reliable Sealing: Equipped with a welded bellows actuator seal for added durability.
  • Efficient Actuation: Utilizes a single pneumatic actuator for streamlined operation.
  • User-Friendly Design: Bonnet flange bolts are designed with retainers to prevent loss during disassembly.

Options

  • Custom Sizing: Available in various custom sizes to fit specific requirements.
  • Diverse O-ring Compounds: Choose from a range of O-ring materials, including Kalrez® and Chemraz®, to suit different applications.

Specifications Table

Temperature (°C)Valve body: 150°C
Valve actuator: 80°C
Pressure Range (torr)1 X 10-9 mbar – ATM
Differential Press (torr)≤ 1.2 bar in either direction
MaterialValve body, bonnet seal, gate: AL6061
Welded bellows: AM350
Valve actuator: SS 304, AL6061
Seal MaterialFluorocarbon (option KALREZ, ETC)
Leak Rate (cc/sec)<1 X 10-9 mbar. l/s
Cycles Until Service (approx.)≥ 2 million
Position IndicatorFESTO: SME-8M-DS-24V-K-2.5-OE
OperationDouble acting

Dimensional Drawings

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FAQ

Sputtering targets are materials used in thin-film deposition processes to create coatings on substrates. They are used in industries like semiconductors, optics, photovoltaics, and electronics.

Evaporation materials are used in Physical Vapor Deposition (PVD) processes, where materials are heated and evaporated to form a thin film on a substrate. These are critical for applications in optics, wear protection, and decorative coatings.

Boat crucibles are used as containers for evaporation materials during PVD processes. They help to uniformly evaporate materials onto the substrate for thin film formation.

Sputtering uses energetic particles to eject material from a target, while evaporation involves heating a material until it vaporizes and deposits on a substrate. Both are common methods in Physical Vapor Deposition (PVD) for creating thin films.

Consider the material composition, purity, target size, and application-specific requirements such as the thickness and uniformity of the film.

Yes, we offer customized sputtering targets, evaporation materials, and crucibles to meet specific customer requirements for size, material composition, and purity.

Yes, we can assist in selecting the most suitable material based on your application, whether it’s for optical coatings, semiconductor fabrication, or decorative finishes.

Yes, we offer both bulk and small quantities of sputtering targets, evaporation materials, and spherical powders to support research, prototyping, and development projects.

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