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Vanadium Silicide Evaporation Materials

VD0770A Vanadium Silicide Evaporation Materials, VSi₂

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Vanadium Silicide Evaporation Materials Overview

Vanadium Silicide evaporation material, known by the chemical formula VSi₂, is a high-performance intermetallic compound ideal for advanced thin-film deposition techniques. At TFM, we supply Vanadium Silicide with outstanding purity and consistency, enabling reliable performance in demanding vacuum coating and semiconductor applications.

Specifications of Vanadium Silicide Evaporation Materials

 

Material TypeVanadium Silicide
SymbolVSi₂
Appearance/ColorGrey Metallic Solid
Melting Point~1,920 °C (3,488 °F; 2,193 K)
Density~5.2 g/cm³
Purity99.5% (Higher purities available upon request)
ShapeTablets / Granules / Powder / Custom forms

Applications of Vanadium Silicide Evaporation Materials

Vanadium Silicide evaporation materials are valued for their exceptional stability and conductive properties, making them suitable for:

  • Thin Film Deposition: Employed in both physical vapor deposition (PVD) and chemical vapor deposition (CVD) methods to form high-performance coatings.

  • Microelectronics: Used as a barrier layer and for metallization in semiconductor fabrication due to its thermal and electrical stability.

  • Protective Coatings: Ideal for forming hard, oxidation-resistant coatings in aerospace and high-temperature component applications.

  • Solar Technology and Displays: Contributes to durable, conductive, and reflective coatings in photovoltaic cells and optical devices.

Packaging and Handling

All Vanadium Silicide evaporation materials from TFM are securely packaged and precisely labeled to ensure traceability and protect against contamination. Our materials are sealed in vacuum or inert atmospheres as necessary, ensuring maximum shelf life and product integrity.

Contact TFM

TFM proudly offers Vanadium Silicide evaporation materials in a variety of sizes and shapes tailored to your specific equipment or process requirements. Whether you need pellets, discs, granules, or custom-machined pieces, our team is ready to assist. We also supply a full range of evaporation accessories, including boats, crucibles, heaters, filaments, and e-beam liners.

To request a quote or learn more about our Vanadium Silicide and other deposition materials, please contact TFM directly. We’re here to support your innovation with reliable materials and expert service.

Product

Vanadium Silicide Granules, VSi2-99.9%, 1~8mm, 100g, Vanadium Silicide Granules, VSi2-99.9%, 1~8mm, 500g

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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