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ytterbium-oxide

VD0740 Ytterbium(III) Oxide Evaporation Materials, Yb2O3

Catalog No.VD0740
MaterialYtterbium Oxide (Yb2O3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier of high-purity ytterbium(III) oxide evaporation materials, along with a wide selection of other evaporation materials. We provide these materials in both powder and granule forms, ensuring versatility for various applications. Customized forms are also available upon request to meet specific project needs.

MSDS File

Ytterbium(III) Oxide Evaporation Materials Overview

TFM offers high-purity ytterbium(III) oxide (Yb2O3) evaporation materials, essential for ensuring high-quality film deposition in various processes. With a chemical formula of Yb2O3, these materials are renowned for their purity and reliability. TFM specializes in producing ytterbium(III) oxide with purities of up to 99.9995%, utilizing rigorous quality control to ensure the highest product standards.

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Ytterbium Evaporation Materials

Ytterbium(III) Oxide Evaporation Materials Specifications

Material TypeYtterbium(III) Oxide
SymbolYb2O3
Appearance/ColorWhite solid
Melting Point2,355 °C (4,271 °F; 2,628 K)
Density9.17 g/cm3, solid.
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications of Ytterbium(III) Oxide Evaporation Materials

Ytterbium(III) oxide evaporation materials are utilized in a variety of advanced applications, such as:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Coatings: Used for wear protection, decorative coatings, and display technologies.

Packaging and Quality Assurance

TFM ensures that ytterbium(III) oxide evaporation materials are carefully packaged and labeled for easy identification and quality control. Extra measures are taken to protect the product from any damage during storage and transportation.

Contact and Customization

TFM is a leading supplier of high-purity ytterbium(III) oxide evaporation materials in various forms, including tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. Additionally, TFM provides a full range of evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing information or inquiries about other materials, feel free to contact TFM for a quote.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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