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ST1006 Yttria Stabilized Zirconia (YSZ) Sputtering Target, Y2O3/ZrO2

Known for its exceptional purity, TFM provides Yttria Stabilized Zirconia Sputtering Targets. With extensive materials science expertise, TFM is dedicated to offering customized solutions and competitive pricing, effectively addressing the needs of nanotechnology and thin-film deposition applications.

MSDS File

Yttria Stabilized Zirconia (YSZ) Sputtering Target Description

Yttria Stabilized Zirconia (YSZ) Sputtering Target is utilized in the sputtering deposition process, a technique for creating thin films by ejecting atoms or ions from a solid target material and depositing them onto a substrate.

YSZ is a solid solution of zirconia and yttria, with yttria serving as a stabilizer for the zirconia crystal structure. This stabilization maintains the high-temperature cubic phase of zirconia at room temperature, preserving its beneficial properties. YSZ is distinguished by its high ionic conductivity, thermal stability, and chemical corrosion resistance. These attributes make it ideal for a range of applications, including solid oxide fuel cells, electrolyte membranes, oxygen sensors, and protective coatings.

Related Product: Yttrium Oxide Sputtering Target, Yttrium Fluoride Sputtering Target

Yttria Stabilized Zirconia (YSZ) Sputtering Target Specifications

Compound FormulaY2O3/ZrO2
Molecular Weight347.69
AppearanceWhite Target
Melting Point>2600℃
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Yttria Stabilized Zirconia (YSZ) Sputtering Target Handling Notes

Indium bonding is recommended for Yttria Stabilized Zirconia (YSZ) Sputtering Targets because YSZ exhibits characteristics such as brittleness and low thermal conductivity that make it challenging for conventional sputtering methods. The material’s low thermal conductivity and susceptibility to thermal shock further support the use of indium bonding to enhance its performance and reliability.

Yttria Stabilized Zirconia (YSZ) Sputtering Target Application

Solid Oxide Fuel Cells (SOFC): Yttria Stabilized Zirconia Sputtering Targets are used to create the electrolyte layer in SOFCs, enhancing cell performance due to their superior ionic conductivity.

Optical Coatings: The high melting point and compatible thermal expansion coefficient of Yttria Stabilized Zirconia make it ideal for producing high-temperature optical coatings, including anti-reflective and thermal barrier coatings.

Ceramic Preparation: Yttria Stabilized Zirconia Sputtering Targets are employed in the fabrication of durable ceramic parts, such as zirconia ceramic blades and bearings, owing to their stability.

Thermal Barrier Coatings: These targets are used to coat high-temperature engine components, providing a thermal barrier that improves component longevity.

Electronics: Yttria Stabilized Zirconia Sputtering Targets are suitable for manufacturing high-performance electronic devices like sensors and capacitors, leveraging their electrical properties and stability.

Yttria Stabilized Zirconia (YSZ) Sputtering Target Packaging

Our Yttria Stabilized Zirconia (YSZ) Sputtering Targets are meticulously managed during storage and transportation to ensure they retain their quality and remain in optimal condition.

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TFM offers Yttria Stabilized Zirconia (YSZ) Sputtering Targets in a range of forms, purities, and sizes. We focus on producing high-purity physical vapor deposition (PVD) materials with exceptional density and minimal average grain sizes. These targets are ideal for use in semiconductor applications, as well as in chemical vapor deposition (CVD) and physical vapor deposition (PVD) for display and optical technologies.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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