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ST0202 Yttrium Oxide Sputtering Target, Y2O3

Chemical Formula: Y2O3
Catalog Number: ST0202
CAS Number: 1314-36-9
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Yttrium Oxide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Target Bonding of Yttrium Oxide Sputtering Target

Indium Bonding and Elastomeric Target Bonding Service are available for Yttrium Oxide Sputtering Target (Y2O3 Sputtering Target). TFM is dedicated to machining standard backing plates and collaborates with the Taiwan Bonding Company to offer bonding services. For inquiries about target bonding materials, methods, and services, please click here.

Specification of Yttrium Oxide Sputtering Target

Material TypeYttrium Oxide
SymbolY2O3
Color/AppearanceWhite, Crystalline Solid
Melting Point (°C)2,410
SputterRF, RF-R
Type of BondIndium, Elastomer
CommentsLoses oxygen; films smooth and clear.

Available Sizes of Yttrium Oxide Sputtering Target

MaterialSize
Yttrium Oxide1.00″ Dia. x 0.125″ Thick
Yttrium Oxide1.00″ Dia. x 0.250″ Thick
Yttrium Oxide2.00″ Dia. x 0.125″ Thick
Yttrium Oxide2.00″ Dia. x 0.250″ Thick
Yttrium Oxide3.00″ Dia. x 0.125″ Thick
Yttrium Oxide3.00″ Dia. x 0.250″ Thick
Yttrium Oxide4.00″ Dia. x 0.125″ Thick
Yttrium Oxide4.00″ Dia. x 0.250″ Thick

Chemical Elements of Yttrium Oxide

YttriumYttrium is a chemical element that originated from Ytterby, Sweden. It was first mentioned in 1794 and observed by Johan Gadolin, with the isolation later accomplished and announced by Carl Gustav Mosander. The chemical symbol for yttrium is “Y,” and it has an atomic number of 39, placing it in Period 5 and Group 3 of the periodic table, within the d-block. The relative atomic mass of yttrium is 88.90585(2) Dalton, with the number in brackets indicating the measurement uncertainty.

Related Product: Yttrium Sputtering Target

OxygenOxygen is a chemical element with the symbol “O,” known for its crucial role in life and various chemical processes. The name “oxygen” comes from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first identified in 1771 by Carl Wilhelm Scheele, who also isolated the element. Oxygen has an atomic number of 8 and is positioned in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in parentheses indicating the uncertainty in measurement.

Packaging

Our Yttrium Oxide Sputter Target is meticulously tagged and labeled on the exterior for efficient identification and quality control. We take great care in handling and packaging to prevent any potential damage during storage or transportation, ensuring that our products reach you in perfect condition.

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TFM offers Yttrium Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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