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Yttrium Aluminum Oxide Sputtering Target

ST0931 Yttrium Aluminum Oxide Sputtering Target, Y3Al5O12, YAG

Chemical FormulaY3Al5O12
Catalog No.ST0931
CAS Number12005-21-9
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Yttrium Aluminum Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Yttrium Aluminum Oxide Sputtering Target (Y₃Al₅O₁₂, YAG)

Introduction

Yttrium Aluminum Oxide (Y₃Al₅O₁₂), commonly known as YAG (Yttrium Aluminum Garnet), is a highly stable oxide material widely used in optical, electronic, and high-temperature applications. As a sputtering target, YAG enables the deposition of durable, optically transparent, and chemically stable thin films. Its excellent mechanical strength and thermal resistance make it particularly attractive for advanced optical coatings and functional oxide layers in demanding environments.

Detailed Description

Our Yttrium Aluminum Oxide Sputtering Targets are manufactured from high-purity Y₃Al₅O₁₂ ceramic powders with carefully controlled stoichiometry. Maintaining the precise Y:Al ratio is critical to preserving the garnet crystal structure, which directly affects optical transparency, refractive index stability, and dielectric performance.

The targets are consolidated through optimized calcination and high-temperature sintering processes to achieve high density and structural uniformity. A dense microstructure minimizes particle generation and improves plasma stability during RF sputtering, resulting in smooth, uniform thin films with consistent optical and electrical properties. YAG targets are typically supplied in round or rectangular formats and can be provided unbonded or bonded to metallic backing plates for enhanced thermal management in higher-power sputtering systems.

Applications

Yttrium Aluminum Oxide (YAG) Sputtering Targets are widely used in:

  • Optical and laser-related thin film coatings

  • Protective and dielectric coatings in harsh environments

  • Transparent insulating layers in electronics

  • Buffer and functional layers in oxide heterostructures

  • High-temperature and wear-resistant coatings

  • Academic and industrial R&D in advanced oxide materials

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionY₃Al₅O₁₂ (YAG)Determines optical and dielectric properties
Purity99.9% – 99.99%Reduces impurity-related optical absorption
Diameter25 – 200 mm (custom available)Compatible with standard sputtering systems
Thickness3 – 6 mmInfluences sputtering lifetime
Density≥ 95% theoreticalImproves plasma stability
Sputtering ModeRF sputteringRequired for ceramic oxides
BondingUnbonded / Cu or Ti backing (optional)Enhances heat dissipation

Comparison with Related Materials

MaterialKey AdvantageTypical Application
YAG (Y₃Al₅O₁₂)High thermal stability & optical transparencyOptical & protective films
Al₂O₃Excellent hardnessProtective coatings
Y₂O₃Good dielectric propertiesElectronic films
MgAl₂O₄ (Spinel)High optical clarityTransparent coatings

FAQ

QuestionAnswer
Can YAG targets be customized?Yes, size, thickness, and bonding options can be tailored.
Is RF sputtering required?Yes, YAG is a ceramic oxide and typically requires RF sputtering.
Are doped YAG targets available?Yes, doped variants can be supplied upon request.
How is the target packaged?Vacuum-sealed with protective foam and export-grade cartons or crates.

Packaging

Our Yttrium Aluminum Oxide (YAG) Sputtering Targets are meticulously labeled and vacuum-sealed to ensure traceability and protection from moisture and contamination. Export-grade packaging safeguards the targets during storage and international shipment.

Conclusion

Yttrium Aluminum Oxide (Y₃Al₅O₁₂, YAG) Sputtering Target offers a reliable solution for depositing high-quality oxide thin films with excellent optical transparency, thermal stability, and dielectric performance. With precise composition control, high density, and flexible customization options, it is well suited for advanced optical coatings, electronics, and research applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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