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Zinc Fluoride Sputtering Target

ST0257 Yttrium Fluoride Sputtering Target, YF3

Chemical Formula: YF3
Catalog Number: ST0257
CAS Number: 13709-49-4
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Yttrium Fluoride  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Yttrium Fluoride Sputtering Target Target

The Yttrium Fluoride Sputtering Target is a fluoride ceramic sputtering target composed of yttrium and fluorine. This target is used in various sputtering processes, including thin film deposition and other applications in multiple industries.

YttriumYttrium, with the chemical symbol “Y,” is named after the village of Ytterby in Sweden. It was first identified in 1794 by J. Gadolin, and its isolation was later accomplished and announced by G. Mosander. Yttrium has an atomic number of 39 and is situated in Period 5 and Group 3 of the periodic table, within the d-block. The relative atomic mass of yttrium is approximately 88.90585(2) Dalton, with the number in parentheses indicating the uncertainty of this measurement.

Related Product: Yttrium Sputtering Target

FluorineFluorine, also known as fluorin, is a chemical element with the symbol “F.” The name derives from the Latin word ‘fluere,’ meaning to flow. Fluorine was first mentioned in 1810 by A.-M. Ampère, with its isolation later successfully accomplished and announced by H. Moissan. It is the 9th element in the periodic table, located in Period 2 and Group 17, within the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, with the number in brackets indicating the uncertainty of this measurement.

Yttrium Fluoride Sputtering Target Application

The Yttrium Fluoride Sputtering Target is widely used in various industries for thin film deposition. It is essential in the production of semiconductors, displays, LEDs, and photovoltaic devices. Additionally, it plays a significant role in decorative applications and functional coatings. This target is also utilized in the optical information storage industry, as well as in the glass coating industry, including applications for automotive and architectural glass, and in optical communication technologies.

Yttrium Fluoride Sputtering Target Packing

Our Yttrium Fluoride Sputter Targets are carefully tagged and labeled on the exterior to ensure efficient identification and stringent quality control. We take great care to protect these targets from potential damage during storage and transportation, ensuring they arrive in optimal condition.

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TFM offers Yttrium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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