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Zinc Copper Evaporation Materials

VD0661 Zinc Copper Evaporation Materials, Zn/Cu

Catalog No.VD0661
MaterialZinc Copper (Zn/Cu)
Purity99.9% ~ 99.999%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity zinc copper evaporation materials, among a diverse range of evaporation products. We provide our materials in both powder and granule forms to meet various application needs. Customized forms can also be arranged based on specific requirements.

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Zinc Copper Evaporation Materials Description

TFM offers high-purity zinc copper evaporation materials, featuring a precise alloy of zinc (Zn) and copper (Cu). These materials are crucial in deposition processes, ensuring the creation of high-quality thin films. Our zinc copper evaporation materials boast a purity level of up to 99.9995%, achieved through stringent quality assurance protocols that guarantee product reliability.

Related Products: Zinc Evaporation Materials, Copper Evaporation Materials

Applications of Zinc Copper Evaporation Materials

Zinc copper evaporation materials are utilized in various applications, including:

  • Deposition Processes: Key in semiconductor fabrication, chemical vapor deposition (CVD), and physical vapor deposition (PVD) for producing superior thin films.
  • Optical Applications: Used in protective coatings, decorative finishes, and display technologies to enhance durability and visual appeal.

Packaging and Handling

Our zinc copper evaporation materials are carefully packaged with clear external labeling to facilitate efficient identification and quality control. We ensure robust protection during storage and transportation to prevent any potential damage.

Contact Us

TFM is a leading provider of high-purity zinc copper evaporation materials, available in various forms such as tablets, granules, rods, and wires. Custom sizes and configurations can be tailored to your specific needs. We also supply additional components like evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing or inquiries about other products not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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