Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
fluoride-targets-removebg-preview-2

ST0258 Zinc Fluoride Sputtering Target, ZnF2

Chemical Formula: ZnF2
Catalog Number: ST0258
CAS Number: 7783-49-5
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zinc Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zinc Fluoride Sputtering Target Description

The Zinc Fluoride Sputtering Target is a fluoride ceramic target composed of zinc and fluorine. It is used in various applications for thin film deposition.

ZincZinc is a chemical element with the symbol “Zn” and atomic number 30. Its name is derived from the German word “zinc,” which may come from the Persian word “sing,” meaning stone. Zinc has been used since ancient times, with early usage dating back to before 1000 BC, and it was discovered by Indian metallurgists. It is located in Period 4 and Group 12 of the periodic table, belonging to the d-block. The relative atomic mass of zinc is 65.409(4) Dalton, with the number in brackets indicating the uncertainty.

Related Product: Zinc Sputtering Target

FluorineFluorine, also known as fluorin, is a chemical element with the symbol “F” and atomic number 9. Its name originates from the Latin word “fluere,” meaning to flow. Fluorine was first mentioned in 1810 by A.-M. Ampère, and its isolation was achieved by H. Moissan. It is located in Period 2 and Group 17 of the periodic table, belonging to the p-block. The relative atomic mass of fluorine is 18.9984032(5) Dalton, with the number in brackets indicating the uncertainty.

Zinc Fluoride Sputtering Target Application

The zinc fluoride sputtering target is employed in various applications including:

  • Thin Film Deposition: For creating coatings on surfaces.
  • Decoration: Used in aesthetic applications where fluoride coatings are beneficial.
  • Semiconductor: In the fabrication of semiconductor devices.
  • Display: Applied in the production of displays, including LCDs and other display technologies.
  • LED and Photovoltaic Devices: Used in the manufacturing of LEDs and solar cells.
  • Functional Coatings: Applied for functional purposes in various industries.
  • Optical Information Storage: Utilized in optical storage technologies.
  • Glass Coating Industry: Used for coating automotive glass, architectural glass, and other types of glass to enhance durability and performance.
  • Optical Communication: Applied in technologies related to optical communication systems.

This versatility makes zinc fluoride sputtering targets valuable across multiple high-tech and industrial applications.

Zinc Fluoride Sputtering Target Packing

Our zinc fluoride sputter targets are meticulously tagged and labeled externally to ensure efficient identification and quality control. We take great care to prevent any damage during storage and transportation, ensuring that the targets arrive in optimal condition.

Get Contact

TFM offers Zinc Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST0258 Zinc Fluoride Sputtering Target, ZnF2”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top