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Zinc Manganese Sulfide Sputtering Target ,ZnMnS

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Zinc Manganese Sulfide Sputtering Target

Introduction

The Zinc Manganese Sulfide (ZnMnS) Sputtering Target is a specialized material widely used in thin film deposition technologies. Its unique semiconductor and optical properties make it particularly valuable for research laboratories, display manufacturing, optoelectronics, and advanced coatings. By incorporating manganese into the zinc sulfide lattice, the material offers tunable electronic and optical characteristics that extend its applications beyond conventional ZnS targets.

Detailed Description

Zinc Manganese Sulfide is a ternary compound material engineered to achieve controlled film growth with enhanced luminescent and magnetic behaviors. Typically fabricated with high density and uniform grain structure, the sputtering target ensures stable sputtering rates and consistent thin-film quality.

  • Purity & Composition: Available in 99.9%–99.99% purity, ensuring minimal contamination during deposition.

  • Form & Dimensions: Standard diameters range from 1″ to 8″, with thicknesses between 3–6 mm. Custom sizes can be manufactured to match different sputtering systems.

  • Bonding Options: Targets can be bonded to copper or titanium backing plates to improve thermal conductivity and mechanical stability during high-power sputtering.

  • Material Features: Incorporating manganese into ZnS introduces magnetic and optical tunability, enabling films with desirable band gap adjustments and luminescence properties.

These attributes make ZnMnS sputtering targets highly reliable for both R&D and industrial thin-film coating applications.

Applications

  • Optoelectronics: Thin films for photodetectors, sensors, and light-emitting devices.

  • Spintronics & Magneto-optics: Used in magnetic semiconductor research and next-generation memory devices.

  • Display Technologies: Thin films for LCD, LED, and emerging flexible displays.

  • Semiconductor Devices: Deposition of functional layers for advanced electronic components.

  • Research & Development: Fundamental studies in luminescent and magnetic thin-film materials.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%High purity ensures minimal defects in thin films
Diameter25 – 300 mm (custom)Compatible with diverse sputtering systems
Thickness3 – 6 mmAffects sputtering rate and lifetime
Density>95% theoreticalHigher density improves film uniformity
BondingCopper / Titanium backingEnhances thermal conductivity & structural support

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Zinc Manganese Sulfide (ZnMnS)Tunable optical & magnetic propertiesOptoelectronic and spintronic devices
Zinc Sulfide (ZnS)High transparency, wide band gapOptical coatings, IR windows
Manganese Sulfide (MnS)Strong magnetic and electronic activityMagnetic thin films
Zinc Oxide (ZnO)Transparent conductive propertiesDisplays, solar cells

FAQ

QuestionAnswer
Can the ZnMnS target be customized?Yes, dimensions, bonding, and purity can be tailored to customer needs.
What packaging is used?Vacuum-sealed with protective foam, shipped in export-safe cartons or wooden crates.
Is it suitable for high-power sputtering?Yes, with copper/titanium backing, it performs well under high-power conditions.
Which industries use it most?Optoelectronics, semiconductors, display technologies, and research institutions.

Packaging

Our Zinc Manganese Sulfide Sputtering Targets are carefully vacuum-sealed and securely packed with shock-absorbing foam. Each target is clearly labeled to ensure traceability and safe handling. Strong export-grade cartons or wooden crates are used for international shipments to guarantee safe delivery.

Conclusion

The Zinc Manganese Sulfide Sputtering Target provides a unique combination of optical, electronic, and magnetic properties, making it an essential material for advanced thin-film research and device manufacturing. Its high purity, stable performance, and customizable specifications ensure reliable results across diverse applications.

For detailed specifications or to request a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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