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ST0477A Zinc Oxide doped with Magnesium Sputtering Targets

MSDS File

Material TypeZinc Oxide doped with Magnesium
SymbolZn0.9Mg0.1O
Color/AppearanceVarious colors, Solid
Melting Point (°C)N/A
Relative Density (g/cc)>95%
Water SolubilityInsoluble
SputterRF, RF-R, DC
Type of BondIndium, Elastomer
CommentsVarious composition available

Zinc Oxide Doped with Magnesium Sputtering Targets

TFM offers high-quality Zinc Oxide (ZnO) doped with Magnesium (Mg) Sputtering Targets, ideal for thin-film deposition, optical coatings, and semiconductor applications. The addition of magnesium to zinc oxide enhances its electrical, optical, and structural properties, making it an excellent choice for advanced electronic devices and optical materials.

Key Features and Advantages

  • High Purity (99.99% – 99.999%) – Ensures exceptional performance in thin-film deposition and electronic applications.

  • Enhanced Optical Properties – Provides high transparency in the visible spectrum while maintaining superior conductivity.

  • Tailored Electrical Characteristics – Magnesium doping allows for precise control over resistivity and carrier concentration, making it ideal for transparent conductive oxides (TCOs).

  • Improved Structural Integrity – Offers enhanced mechanical properties and stability in high-performance thin-film applications.

  • Optimized for Thin-Film Deposition – Compatible with RF sputtering and DC sputtering techniques, ensuring uniform coating quality.

Applications

  • Transparent Conductive Oxides (TCOs) – Used in touchscreens, solar cells, displays, and OLEDs, where transparent conductivity is crucial.

  • Optoelectronic Devices – Applied in LEDs, photodetectors, and solar cells for improved light emission and optical performance.

  • Semiconductor Electronics – Ideal for thin-film transistors, electronic sensors, and circuit boards that require transparent and conductive materials.

  • Solar Energy Applications – Enhances the performance of thin-film solar panels by improving energy conversion efficiency through TCO layers.

Industry Impact

TFM’s Zinc Oxide doped with Magnesium Sputtering Targets are a vital material in cutting-edge applications in the optical, electronics, and semiconductor industries. With superior purity, tailored electrical and optical properties, and reliable deposition characteristics, these sputtering targets are the ideal choice for high-performance thin films in solar energy and optical device fabrication.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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