Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors

ST1007 Zinc Oxide doped with Magnesium Sputtering Target, ZnMgO

Chemical FormulaZnMgO
Catalog No.ST1007
CAS Number
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Known for their exceptional purity, TFM provides Zinc Oxide doped with Magnesium Sputtering Targets. Drawing on extensive materials science expertise, TFM is dedicated to offering customized solutions and competitive pricing to meet the specific needs of nanotechnology and thin-film deposition applications.

Zinc Oxide doped with Magnesium Sputtering Target Description

Zinc Oxide doped with Magnesium Sputtering Targets offer excellent transparency across both visible and UV spectral ranges, making them ideal for creating optical coatings and transparent conductive films. Their semiconducting properties, derived from both zinc oxide and magnesium oxide, make these targets crucial for manufacturing electronic devices like thin-film transistors and light-emitting diodes. The ratio of zinc oxide to magnesium oxide can be adjusted to modify the bandgap of ZnMgO, providing flexibility in energy band engineering and optoelectronic applications. ZnMgO is also known for its good electrical conductivity, making it suitable for conductive coatings and transparent conductive films. Additionally, ZnMgO demonstrates strong thermal stability at high temperatures, which is beneficial for high-temperature coatings and electronics.

Related Product: Zinc Sputtering Target, Indium Zinc Oxide Sputtering Target

Zinc Oxide doped with Magnesium Sputtering Target Specifications

Compound FormulaZnMgO
AppearanceWhite Target
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Zinc Oxide doped with Magnesium Sputtering Target Handling Notes

Indium bonding is recommended for Zinc Oxide doped with Magnesium Sputtering Targets because of their inherent brittleness and low thermal conductivity, which can make them challenging for conventional sputtering methods. The material’s low thermal conductivity and susceptibility to thermal shock further underscore the need for indium bonding to enhance its performance and reliability.

Zinc Oxide doped with Magnesium Sputtering Target Application

Optical Coatings: Zinc Oxide doped with Magnesium Sputtering Targets are highly transparent and are commonly used to create optical coatings, including anti-reflective coatings and optical filters.

Transparent Conductive Films: The semiconducting properties and excellent conductivity of ZnMgO make it ideal for transparent conductive films used in electronic devices such as displays, solar cells, and touch screens.

Electronic Devices: These sputtering targets are crucial in the fabrication of electronic devices, including thin-film transistors, light-emitting diodes, and photodiodes.

Conductive Coatings: ZnMgO’s superior conductivity makes it suitable for producing conductive coatings used in electronics, optics, and display technologies.

Energy Band Engineering: By adjusting the ratio of ZnO to MgO, the bandgap of ZnMgO can be tailored, offering potential for applications in energy band engineering and semiconductor material research.

Zinc Oxide doped with Magnesium Sputtering Target Packaging

Our Zinc Oxide doped with Magnesium Sputtering Targets are meticulously managed during storage and transportation to maintain their quality and ensure they arrive in optimal condition.

Get Contact

TFM offers Zinc Oxide doped with Magnesium Sputtering Targets in a variety of forms, purities, and sizes. We specialize in high-purity physical vapor deposition (PVD) materials, ensuring exceptional density and minimal average grain sizes. These targets are designed for use in semiconductor applications, as well as in chemical vapor deposition (CVD) and physical vapor deposition (PVD) for display and optical technologies.

Reviews

There are no reviews yet.

Be the first to review “ST1007 Zinc Oxide doped with Magnesium Sputtering Target, ZnMgO”

Your email address will not be published. Required fields are marked *

Related Products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top