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ST0203 Zinc Oxide Sputtering Target, ZnO

Chemical Formula: ZnO
Catalog Number: ST0203
CAS Number: 1314-13-2
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zinc Oxide  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zinc Oxide Sputtering Target Description

The zinc oxide sputtering target from TFM is a high-quality oxide sputtering material with the chemical formula ZnO. This material is widely used in various thin film deposition applications, including electronics, optoelectronics, and photovoltaic devices. Zinc oxide is known for its excellent electrical and optical properties, making it an ideal choice for applications requiring transparent conductive oxides.

ZincZinc is a chemical element that originated from the German, ‘zinc’, which may, in turn, be derived from the Persian word ‘sing’, meaning stone. It was early used before 1000 BC and discovered by Indian metallurgists. “Zn” is the canonical chemical symbol of zinc. Its atomic number in the periodic table of elements is 30 with a location at Period 4 and Group 12, belonging to the d-block. The relative atomic mass of zinc is 65.409(4) Dalton, the number in the brackets indicating the uncertainty.

Related Product: Zinc Sputtering Target

OxygenOxygen, a chemical element, derives its name from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first described in 1771 and observed by the chemist Carl Wilhelm Scheele. Scheele’s work also led to the successful isolation of oxygen, which he later announced. The chemical symbol for oxygen is “O,” and it has an atomic number of 8. This element is located in Period 2 and Group 16 of the periodic table, belonging to the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, with the number in brackets indicating the measurement uncertainty.

Zinc Oxide Sputtering Target Specification

Compound FormulaZnO
Molecular Weight81.37
AppearanceWhite Powder
Melting Point1,975° C
Boiling Point2,360° C
Density5.6 g/cm3

Zinc Oxide Sputtering Target Packaging

Our zinc oxide sputtering target is meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control. We take significant precautions to prevent any damage during storage or transportation, ensuring the product arrives in perfect condition.

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TFM offers Zinc Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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