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Zinc Oxide with Gallium Oxide Sputtering Target

ST0205 Zinc Oxide with Gallium Oxide Sputtering Target, ZnO/Ga2O3

Chemical Formula: ZnO/Ga2O3
Catalog Number: ST0205
CAS Number: 1314-13-2 | 1202
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

 Zinc Oxide with Gallium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Zinc Oxide doped with Gallium Oxide sputtering targets, commonly known as GZO sputtering targets, are advanced transparent conductive oxide (TCO) materials designed for high-performance thin film deposition. By introducing gallium oxide into the ZnO lattice, these targets deliver improved electrical conductivity, excellent optical transparency, and enhanced thermal stability, making them a strong alternative to ITO for modern optoelectronic applications.

Detailed Description

Zinc Oxide doped with Gallium Oxide sputtering targets are produced by homogeneously dispersing Ga₂O₃ within a ZnO ceramic matrix using controlled powder synthesis and high-temperature sintering. Precise gallium doping is critical, as Ga³⁺ ions act as effective donors in ZnO, increasing carrier concentration while preserving high transparency in the visible range.

The resulting targets exhibit high density, uniform microstructure, and stable sputtering behavior, which are essential for achieving consistent film thickness, low resistivity, and minimal particle generation during deposition. For higher power densities or extended sputtering cycles, GZO targets can be supplied bonded to copper backing plates to improve heat dissipation and mechanical integrity. Unbonded ceramic targets are also available for smaller sizes or low-power applications.

These targets are typically used with RF magnetron sputtering systems, ensuring efficient deposition of high-quality transparent conductive films in both research and production environments.

Applications

  • Transparent conductive layers for displays and touch panels

  • Thin film solar cells and photovoltaic devices

  • LEDs and optoelectronic components

  • Flat panel displays (LCD, OLED)

  • TCO material research and development

Technical Parameters

ParameterTypical Value / RangeImportance
MaterialZinc Oxide doped with Gallium Oxide (GZO)Transparent conductive oxide
Ga₂O₃ Doping Level1 – 5 wt.% (customizable)Controls conductivity & transparency
Purity99.9% – 99.99% (total)Affects electrical & optical performance
Target FormDisc / Plate (bonded or unbonded)Compatible with sputtering systems
Diameter25 – 300 mm (custom)Fits standard magnetron cathodes
Thickness3 – 6 mm (typical)Influences target lifetime
Sputtering MethodRF magnetron sputteringIdeal for oxide ceramics
Backing PlateCopper (optional)Enhances heat transfer & stability

Comparison with Related TCO Targets

MaterialKey AdvantageTypical Application
Zinc Oxide doped with Gallium Oxide (GZO)ITO alternative, stable conductivityDisplays & photovoltaics
Indium Tin Oxide (ITO)Very low resistivityHigh-end optoelectronics
Aluminum-Doped ZnO (AZO)Cost-effectiveLarge-area coatings

FAQ

QuestionAnswer
Can the gallium oxide content be adjusted?Yes, Ga₂O₃ concentration can be customized to meet performance requirements.
Is RF sputtering required?RF magnetron sputtering is typically recommended for GZO targets.
Are bonded targets available?Yes, copper-backed targets are available for higher power operation.
Can large-diameter targets be supplied?Yes, targets up to 300 mm or larger can be produced on request.
Is a Certificate of Analysis available?Yes, CoA is available upon request.

Packaging

Our Zinc Oxide doped with Gallium Oxide sputtering targets are carefully labeled and vacuum-sealed or inert-gas packed to prevent moisture absorption and contamination. Shock-absorbing materials and export-grade cartons or wooden crates ensure safe transportation and storage.

Conclusion

Zinc Oxide doped with Gallium Oxide sputtering targets (GZO targets) offer an excellent balance of transparency, conductivity, and thermal stability for next-generation optoelectronic and energy applications. With flexible doping control, reliable quality, and full customization support, these targets are well suited for both research and industrial PVD processes.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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