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ST0316 Zinc Selenide Sputtering Target, ZnSe

Chemical Formula: ZnSe
Catalog Number: ST0316
CAS Number: 1315-09-9
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zinc Selenide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zinc Selenide Sputtering Target Description

A Zinc Selenide Sputtering Target is a type of ceramic material composed of zinc and selenium, used in sputtering processes. This target is typically employed in thin film deposition and various specialized applications due to the unique properties of the zinc-selenium combination.

ZincZinc is a chemical element with the symbol “Zn” and an atomic number of 30. The name “zinc” originates from the German word ‘zinc,’ which may in turn be derived from the Persian word ‘sing,’ meaning stone. Zinc has been used since before 1000 BC and was discovered by Indian metallurgists. It is located in Period 4 and Group 12 of the periodic table, belonging to the d-block elements. The relative atomic mass of zinc is approximately 65.409 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Zinc (Zn) Sputtering Target

SeleniumSelenium is a chemical element with the symbol “Se” and an atomic number of 34. The name “selenium” is derived from the Greek word ‘selene,’ meaning moon. It was first mentioned in 1817 and observed by Jöns Jacob Berzelius and Johan Gottlieb Gahn, who also achieved and announced its isolation. Selenium is located in Period 4 and Group 16 of the periodic table, classified within the p-block elements. Its relative atomic mass is approximately 78.96 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Selenium (Se) Sputtering Target

Zinc Selenide Sputtering Target Specification

Material TypeZinc Selenide
SymbolZnSe
Color/AppearanceYellow to Red, Crystalline Solid
Melting Point (°C)>1,100
Theoretical Density (g/cc)5.42
SputterRF
Type of BondIndium, Elastomer
CommentsPreheat gently to outgas. Evaporates well.

Zinc Selenide Sputtering Target Bonding Services

Specialized bonding services for Zinc Selenide Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

 

Packaging

Our Zinc Selenide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

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TFM offers Zinc Selenide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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