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ST0042 Selenium Sputtering Target, Se

Chemical Formula: Se
Catalog Number: ST0042
CAS Number: 7782-49-2
Purity: >99.99%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

SeleniumĀ  sputtering targetĀ  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

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Selenium Sputtering Target, Se with Backing Plate, Made by TFM Selenium Sputtering Target, Se with Backing Plate, Made by TFM

Introduction

The Selenium Sputtering Target (Se) is a high-purity elemental target used in thin film deposition for semiconductor, photovoltaic, and optoelectronic applications. Selenium plays a crucial role in many compound semiconductor systems, particularly in chalcogenide materials and thin-film solar technologies. When deposited as a thin film through magnetron sputtering or other physical vapor deposition (PVD) processes, selenium contributes to the formation of functional materials with unique optical and electronic properties.

Selenium-based thin films are widely used in CIGS solar cells, photodetectors, phase-change materials, and semiconductor research, making selenium sputtering targets an important component in modern materials engineering and energy technologies.

Detailed Description

Selenium sputtering targets are typically manufactured from high-purity selenium through controlled casting, pressing, or sintering processes to achieve a dense and uniform target structure. High purity is essential because even small amounts of impurities can significantly affect the electrical and optical properties of selenium-containing thin films.

Selenium belongs to the chalcogen group of elements and exhibits semiconducting properties with strong photoelectric sensitivity. In thin film deposition systems, selenium is often used either as a standalone film or as a precursor material for compound semiconductor layers.

One of the most important applications of selenium sputtering targets is in the production of copper indium gallium selenide (CIGS) absorber layers used in high-efficiency thin-film solar cells. Selenium also plays a role in the synthesis of other compound materials such as zinc selenide (ZnSe), cadmium selenide (CdSe), and other chalcogenide semiconductors.

High-density selenium targets help ensure stable sputtering rates and uniform film composition during deposition. For improved mechanical stability and thermal management, selenium sputtering targets may also be supplied as bonded targets with copper backing plates, typically using indium bonding.

Applications

Selenium sputtering targets are used in several advanced technology sectors:

  • Thin film solar cells, particularly CIGS photovoltaic absorber layers

  • Compound semiconductor deposition for optoelectronic devices

  • Infrared and photodetector materials

  • Chalcogenide semiconductor research and thin film electronics

  • Optical coatings requiring specific absorption properties

  • Advanced materials development in research laboratories

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.999%High purity ensures stable electronic and optical film properties
Chemical SymbolSeDetermines elemental composition of thin films
Diameter25 – 300 mm (custom)Compatible with standard sputtering systems
Thickness3 – 6 mmInfluences sputtering stability and target lifetime
Density≄ 95% theoretical densityEnsures uniform sputtering and film growth
BondingCopper backing plate / Indium bondedImproves thermal stability during deposition

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Selenium (Se)Strong photoelectric response and semiconductor propertiesSolar cells and photodetectors
Tellurium (Te)Excellent thermoelectric and semiconductor propertiesThermoelectric materials and detectors
Sulfur (S)Important chalcogen element for compound semiconductorsSemiconductor synthesis and coatings

FAQ

QuestionAnswer
What sputtering methods are suitable for selenium targets?Selenium sputtering targets can be used in RF or DC magnetron sputtering systems depending on system configuration.
Can selenium targets be customized?Yes. Diameter, thickness, and bonding options can be customized to match different sputtering systems.
Are bonded sputtering targets available?Yes. Selenium targets can be bonded to copper backing plates using indium bonding for improved thermal management.
What purity levels are typically available?Standard purities range from 99.9% up to 99.999% depending on application requirements.
What substrates can selenium films be deposited on?Selenium films can be deposited on glass, silicon wafers, metal substrates, and other semiconductor materials.

Packaging

Our Selenium Sputtering Target (Se) products are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control standards. Each target is packaged in vacuum-sealed bags with protective foam and export-grade cartons or wooden crates to prevent contamination, oxidation, and mechanical damage during storage and transportation.

Conclusion

The Selenium Sputtering Target (Se) is an essential material for depositing semiconductor and chalcogenide thin films used in solar energy technologies, photodetectors, and advanced optoelectronic devices. Its unique photoelectric and semiconducting properties make it highly valuable for both industrial manufacturing and research applications.

With high-purity materials, customizable dimensions, and stable sputtering performance, selenium sputtering targets support a wide range of modern thin film technologies.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

Order Now

Ƙ1" Ɨ 3.18 mm, Selenium (Se), 4N, Ƙ2" Ɨ 3 mm + 3 mm Ti Backing Plate, Selenium (Se), 4N, Ƙ2" Ɨ 3.18 mm, Selenium (Se), 4N, Ƙ2" Ɨ 6.35 mm + 3 mm Ti Backing Plate, Selenium (Se), 4N

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Alā‚‚Oā‚ƒ, SiOā‚‚, TiOā‚‚), alloys, or composites—chosen based on the film’s desired properties.

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They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

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In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

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Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

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Operators monitor target erosion (often by measuring the depth of the eroded ā€œrace trackā€) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

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Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

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DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

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In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also ā€œpoisonā€ the target surface if not carefully controlled.

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Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

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Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

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