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VD0663 Zirconium Aluminum Evaporation Materials, Zr/Al

Catalog No.VD0663
MaterialZirconium Aluminum (Zr/Al)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier specializing in high-purity zirconium and aluminum evaporation materials. Our extensive product line includes both powder and granule forms of these materials. We also offer customization options to meet specific needs upon request.

MSDS File

Overview of Zirconium Aluminum Evaporation Materials

TFM offers high-purity zirconium aluminum evaporation materials, which are essential for achieving superior quality in deposition processes. Our zirconium aluminum alloy, combining Zr and Al, is crafted to meet purity levels of up to 99.9995%. This high level of purity is crucial for ensuring the reliability and effectiveness of deposited films.

Applications of Zirconium Aluminum Evaporation Materials

Our zirconium aluminum materials are versatile and used across various applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Suitable for wear protection, decorative coatings, and display technologies.

Packaging and Handling

To maintain the integrity and quality of our zirconium aluminum materials, each package is meticulously labeled and tagged. We ensure secure packaging to prevent any damage during storage and transportation.

Contact Information

TFM is a leading provider of high-purity zirconium aluminum evaporation materials, available in a range of forms such as tablets, granules, rods, and wires. We also offer custom shapes and quantities upon request. Additionally, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to inquire about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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