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zirconium-carbide

VD0771 Zirconium Carbide Evaporation Materials, ZrC

Catalog No.VD0771
MaterialZirconium Carbide (ZrC)
Purity99.5%
ShapePowder/ Granule/ Custom-made

At TFM, we are recognized as a top-tier producer and supplier of high-purity Zirconium Carbide evaporation materials, among other specialized evaporation solutions. Our product range includes both powder and granule forms of evaporation materials, with the added flexibility of custom forms available upon request. Whether you need standard or tailored options, TFM is dedicated to providing high-quality materials to meet your specific requirements.

MSDS File
Zirconium Carbide Evaporation Materials Overview

Zirconium Carbide (ZrC) is a high-grade ceramic evaporation material renowned for its purity and effectiveness in advanced deposition processes. TFM excels in delivering Zirconium Carbide with purity levels reaching up to 99.9995%, ensuring superior quality in deposited films across various applications.

Specifications

Material TypeZirconium Carbide
SymbolZrC
Appearance/ColorGray Solid
Melting Point3,532~3,540 °C (6,390~6,404 °F; 3,805~3,813 K)
Density6.73 g/cm3
Purity99.5%
ShapePowder/ Granule/ Custom-made

Applications

Zirconium Carbide evaporation materials are essential for a range of high-tech applications, including:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Used in wear protection, decorative coatings, and display technologies.

Packaging

TFM ensures that Zirconium Carbide materials are clearly tagged and labeled for easy identification and quality control. Our packaging is designed to protect the materials from damage during storage and transport.

Contact Us

TFM is a leading supplier of high-purity Zirconium Carbide evaporation materials, available in various forms such as tablets, granules, rods, and wires. Custom forms and quantities are also offered. In addition to evaporation materials, we provide sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about other materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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