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VD0664 Zirconium Copper Evaporation Materials, Zr/Cu

Catalog No.VD0664
MaterialZirconium Copper (Zr/Cu)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM stands out as a premier manufacturer and supplier of high-purity zirconium copper evaporation materials, along with an extensive range of other evaporation materials. We provide these materials in both powder and granule forms, and we’re also able to accommodate custom requests to meet specific needs.

MSDS File

Zirconium Copper Evaporation Materials Overview

TFM offers zirconium copper evaporation materials, a specialized alloy composed of zirconium (Zr) and copper (Cu). These high-purity materials are essential in various deposition processes to produce high-quality films. Our zirconium copper evaporation materials achieve a remarkable purity of up to 99.9995%, ensuring optimal performance and reliability through rigorous quality control.

Related Products: Zirconium Evaporation Materials, Copper Evaporation Materials

Applications of Zirconium Copper Evaporation Materials

Our zirconium copper evaporation materials are versatile and used in several key applications:

  • Deposition Processes: Ideal for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD) techniques.
  • Optics: Employed in wear-resistant coatings, decorative finishes, and display technologies.

Packaging and Handling

TFM ensures that all zirconium copper evaporation materials are clearly tagged and labeled for easy identification and quality assurance. We meticulously package our products to prevent damage during storage and transportation.

Contact Us

As a leading provider of high-purity zirconium copper evaporation materials, TFM offers these materials in various forms, including tablets, granules, rods, and wires. We also accommodate custom requests for specific forms and quantities. In addition to evaporation materials, we supply evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and to inquire about materials not listed, please reach out to us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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