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Zinc Fluoride Sputtering Target

ST0259 Zirconium Fluoride Sputtering Target, ZrF4

Chemical Formula: ZrF4
Catalog Number: ST0259
CAS Number: 7783-64-4
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Zirconium Fluoride Sputtering Target (ZrF₄) is a specialty fluoride ceramic target used in thin-film deposition where low optical absorption, high infrared transparency, and precise fluoride chemistry are required. ZrF₄ is a key material in advanced optical, photonic, and infrared applications, particularly for coatings operating in the mid-IR to far-IR range. Its unique optical and chemical properties make it an important choice for research laboratories and high-end optical coating systems.

Detailed Description

Zirconium Fluoride sputtering targets are produced from high-purity ZrF₄ raw materials using carefully controlled powder processing, consolidation, and sintering techniques. Due to the hygroscopic nature of fluoride materials, strict environmental controls are applied throughout manufacturing, machining, and packaging to prevent moisture uptake and compositional degradation.

The resulting ZrF₄ target features uniform composition, controlled density, and stable sputtering behavior, enabling reproducible thin-film deposition. Compared with oxide targets, ZrF₄ allows the formation of fluoride thin films with lower phonon energy and reduced infrared absorption, which is critical for IR optics and laser-related applications.

ZrF₄ sputtering targets are typically used in RF magnetron sputtering systems. Process parameters such as power density, substrate temperature, and background gas composition are optimized to achieve smooth films with precise stoichiometry and excellent optical performance.

Applications

Zirconium Fluoride sputtering targets are widely used in:

  • Infrared (IR) optical coatings

  • Anti-reflection coatings for IR lenses and windows

  • Fluoride-based optical multilayer stacks

  • Laser optics and photonic components

  • Specialty optical and scientific instrumentation

  • Advanced thin-film materials research

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaZrF₄Defines fluoride optical properties
Purity99.9% – 99.99%Minimizes optical absorption
Target Diameter25 – 300 mm (custom)Compatible with standard sputtering guns
Thickness3 – 6 mm (custom available)Affects sputtering stability
Density≥ 95% of theoreticalEnsures uniform erosion
Hygroscopic ControlControlled handling & sealingMaintains material integrity
Deposition MethodRF Magnetron SputteringSuitable for fluoride ceramics

Comparison with Related Fluoride Targets

MaterialKey AdvantageTypical Application
Zirconium Fluoride (ZrF₄)Low IR absorptionIR optics & coatings
Magnesium Fluoride (MgF₂)Wide transparency rangeAR coatings
Yttrium Fluoride (YF₃)Chemical stabilityOptical multilayers
Lanthanum Fluoride (LaF₃)High refractive indexIR optical stacks

FAQ

QuestionAnswer
Is ZrF₄ suitable for infrared optics?Yes, it is widely used for IR optical coatings due to low absorption.
Does ZrF₄ absorb moisture?Yes, strict moisture control and vacuum packaging are essential.
Is RF sputtering required?RF sputtering is recommended for stable deposition of fluoride ceramics.
Can small R&D targets be supplied?Yes, laboratory-scale sizes are available.
How is the target packaged?Vacuum-sealed with moisture-resistant protective materials.

Packaging

Our Zirconium Fluoride Sputtering Targets (ZrF₄) are meticulously vacuum-sealed and externally labeled to ensure accurate identification and strict quality control. Moisture-resistant wrapping and shock-absorbing packaging are used to protect the target from humidity and mechanical damage during storage and international transportation.

Conclusion

The Zirconium Fluoride Sputtering Target (ZrF₄) provides a reliable solution for depositing high-performance fluoride thin films with excellent infrared transparency and optical stability. With controlled purity, customizable dimensions, and carefully managed handling, ZrF₄ targets are an excellent choice for advanced optical coating and photonic research applications.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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