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ST0259 Zirconium Fluoride Sputtering Target, ZrF4

Chemical Formula: ZrF4
Catalog Number: ST0259
CAS Number: 7783-64-4
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium Fluoride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zirconium Fluoride Sputtering Target Description

Zirconium fluoride sputtering targets are fluoride ceramic targets composed of zirconium and fluorine. These targets are used in various thin film deposition processes.

Zirconium

Zirconium is a chemical element that originated from the Persian word ‘zargun,’ meaning gold-colored. It was first mentioned in 1789 and observed by H. Klaproth, with its isolation later achieved and announced by J. Berzelius. Its chemical symbol is “Zr,” and it has an atomic number of 40. Zirconium is located in Period 5 and Group 4 of the periodic table, belonging to the d-block. The relative atomic mass of zirconium is 91.224(2) Dalton, with the number in parentheses indicating the uncertainty.

Related Product: Zirconium Sputtering Target

Fluorine

Fluorine, also known as fluorin, is a chemical element named from the Latin ‘fluere,’ meaning to flow. It was first mentioned in 1810 and observed by A.-M. Ampère, with its isolation later achieved and announced by H. Moissan. The chemical symbol for fluorine is “F,” and it has an atomic number of 9. Fluorine is located in Period 2 and Group 17 of the periodic table, belonging to the p-block. Its relative atomic mass is 18.9984032(5) Dalton, with the number in parentheses indicating the uncertainty.

Zirconium Fluoride Sputtering Target Application

The zirconium fluoride sputtering target is used for various applications including thin film deposition, decoration, semiconductor fabrication, display technologies, LED and photovoltaic devices, and functional coatings. It is also utilized in the optical information storage industry, glass coating applications such as car glass and architectural glass, as well as in optical communication technologies.

Zirconium Fluoride Sputtering Target Packing

Our zirconium fluoride sputter targets are meticulously tagged and labeled externally to facilitate efficient identification and maintain quality control. We take great care to prevent any damage during storage or transportation, ensuring the targets arrive in optimal condition.

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TFM offers Zirconium Fluoride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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