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ST0517 Zirconium Oxide with Calcium Oxide Sputtering Target, ZrO2/CaO

Chemical Formula: ZrO2/CaO
Catalog Number: ST0517
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium Oxide with Calcium Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zirconium Oxide with Calcium Oxide Sputtering Target Description

ZirconiumZirconium, symbolized by Zr and with atomic number 40, is a lustrous, grey-white transition metal. It closely resembles hafnium and, to a lesser extent, titanium. Primarily used as a refractory and opacifier, zirconium also serves as an alloying agent due to its corrosion resistance. It forms various inorganic and organometallic compounds, including zirconium dioxide and zirconocene dichloride. Out of its five natural isotopes, three are stable. Zirconium compounds do not have known biological roles.

CalciumCalcium, derived from the Latin *calx* meaning lime, was first identified in 1808 by H. Davy, who also accomplished its isolation. The canonical symbol for calcium is “Ca,” and it has an atomic number of 20. Located in Period 4, Group 2, and the s-block of the periodic table, calcium has a relative atomic mass of 40.078(4) Dalton, with the number in brackets indicating uncertainty.

Related Product: Zirconium Sputtering Target, Calcium Sputtering Target.

Zirconium Oxide with Calcium Oxide Sputtering Target Specifications

Material TypeZirconium Oxide with Calcium Oxide
SymbolZrO2/CaO
Color/AppearanceSolid
Melting Point/
Density/
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Zirconium Oxide with Calcium Oxide Sputtering Target Applications

Zirconium Oxide with Calcium Oxide Sputtering Targets are utilized in several high-tech industries:

  • Optical Coatings: Provide high refractive index, optical clarity, and durability for precision optical coatings.
  • Thin-Film Electronics: Essential for manufacturing advanced thin-film transistors, integrated circuits, and sensors.
  • Optoelectronics: Ideal for use in LEDs, photovoltaic cells, and displays.
  • Materials Research: Useful in developing advanced thin films with specific properties for research and development.

Packing

Our Zirconium Oxide with Calcium Oxide Sputtering Targets are clearly tagged and labeled for efficient identification and quality control. We ensure they are carefully handled to prevent any damage during storage or transportation.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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