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ST0059 Zirconium Sputtering Target, Zr

Chemical Formula: Zr
Catalog Number: ST0059
CAS Number: 7440-67-7
Purity: 99%, 99.9%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zirconium Sputtering Target Description

Zirconium

The zirconium sputtering target shares properties with its source material, zirconium. With the chemical symbol “Zr” and atomic number 40, zirconium is a lustrous, grey-white, strong transition metal that closely resembles hafnium and, to a lesser extent, titanium. It is primarily used as a refractory and opacifier, though small amounts are utilized as an alloying agent due to its strong resistance to corrosion. Zirconium forms various inorganic and organometallic compounds, such as zirconium dioxide and zirconocene dichloride. Of the five naturally occurring isotopes of zirconium, three are stable. Notably, zirconium compounds have no known biological role. These properties make zirconium sputtering targets valuable in producing thin films and coatings for high-tech industries, including electronics, optics, and materials science.

Zirconium Sputtering Target Specification

Material TypeZirconium
SymbolZr
Melting Point 1,852 °C
Color/AppearanceSilvery White, Metallic
Theoretical Density6.49 g/cc
SputterDC
Type of BondIndium, Elastomer
CommentsAlloys with W. Films oxidize readily.
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Zirconium Sputtering Target Application

The zirconium sputtering target is widely used for thin film deposition, fuel cells, decoration, semiconductors, displays, LEDs, and photovoltaic devices. It also plays a crucial role in functional coatings and various optical information storage industries, as well as the glass coating industry, including car and architectural glass, optical communication, and more.

Zirconium metal itself is extensively used in the nuclear industry for cladding fuel elements in nuclear reactors due to its low absorption cross-section for neutrons. Its high resistance to corrosion by many common acids, alkalis, and seawater makes it invaluable in the chemical industry where corrosive agents are employed. Additionally, zirconium is used as an alloying agent in steel, for manufacturing surgical appliances, and for making superconducting magnets using zirconium/niobium alloys, which exhibit superconductivity at low temperatures. Alloys with zinc become magnetic below 35 K. Furthermore, zirconium is used as a “getter” in vacuum tubes, in flashbulbs for photography, explosive primers, and lamp filaments due to its diverse and robust properties.

Zirconium Sputtering Target Target Bonding

Specialized bonding services for Zirconium Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Packing

Our zirconium sputtering targets are clearly tagged and labeled externally to ensure efficient identification and quality control. We take great care to avoid any damage during storage or transportation, ensuring the highest quality and integrity of the product upon delivery. These measures guarantee that our customers receive zirconium sputtering targets in optimal condition, ready for use in various high-tech applications, including thin film deposition, fuel cells, semiconductors, displays, LEDs, photovoltaic devices, and more.

Get Contact

TFM offers Zirconium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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