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VD0667 Zirconium Tungsten Evaporation Materials, Zr/W

Catalog No.VD0667
MaterialZirconium Tungsten (Zr/W)
Purity99.5%
ShapePowder/ Granule/ Custom-made

TFM excels in manufacturing and supplying high-purity zirconium-tungsten evaporation materials, along with a diverse range of other evaporation materials. Our zirconium-tungsten products are available in both powder and granule forms, with options for custom specifications to suit your needs.

 

MSDS File

Zirconium Tungsten Evaporation Materials Description

TFM provides high-purity zirconium-tungsten alloy evaporation materials, crucial for achieving superior deposited films in various applications. Our zirconium-tungsten materials, composed of Zr and W, are manufactured to purity levels of up to 99.9995%. We employ rigorous quality assurance processes to ensure the reliability and excellence of our products.

Related Products: Zirconium Evaporation Materials, Tungsten Evaporation Materials

Applications of Zirconium Tungsten Evaporation Materials

Zirconium-tungsten evaporation materials are utilized in:

  • Deposition Processes: Suitable for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Used for applications such as wear protection, decorative coatings, and display technologies.

Packaging and Handling

Our zirconium-tungsten evaporation materials are carefully tagged and labeled to ensure proper identification and quality control. We take meticulous care in packaging to prevent any damage during storage and transportation.

Contact Us

TFM is a leading supplier of high-purity zirconium-tungsten evaporation materials, available in various forms including tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. We also offer evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing information or to inquire about additional products, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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