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Zirconium (Zr) Rotary Sputtering Target

Introduction

TFM provides high-quality Zirconium Zr Rotary Sputtering Target, ideal for thin-film deposition in a variety of advanced applications, including semiconductors, coatings, and optics. Zirconium targets are known for their exceptional chemical resistance, high melting point, and excellent adhesion properties, making them ideal for hard coatings, optical coatings, and thin-film resistors.

The rotary sputtering target design ensures efficient, uniform deposition of Zirconium films, which are widely used in protective coatings for aerospace and medical devices, as well as in catalysts and electronic devices. Zirconium films are particularly valuable for applications requiring high corrosion resistance and thermal stability. Their low friction coefficient also makes them useful in tribological coatings. Furthermore, Zirconium oxide (ZrO₂) films, commonly produced from zirconium targets, are crucial in thermal barrier coatings and high-temperature applications, providing both insulation and wear resistance.

Zirconium-based coatings are often used for optical devices as they provide excellent light transmission and durability. Additionally, Zirconium nitride (ZrN) films, created using Zirconium targets, are widely employed in hard coatings for cutting tools, wear-resistant surfaces, and decorative coatings due to their gold-like appearance and exceptional hardness.

TFM offers customized Zirconium Zr rotary sputtering targets, with precise control over material purity and composition, ensuring optimal deposition performance in a variety of industries such as electronics, aerospace, and medical technologies. These targets provide consistent and reliable results for thin-film deposition processes and are designed to meet the rigorous demands of high-performance coatings, advanced semiconductor devices, and cutting-edge applications.

Our Zirconium Zr rotary sputtering targets are manufactured with the highest standards of quality, ensuring superior film quality and precise deposition characteristics. With high density, low impurity levels, and tailored specifications, TFM’s Zirconium targets are perfect for producing high-performance thin films in thin-film electronics, optical coatings, and surface modification technologies.

Zirconium Zr Rotary Sputtering Target Specifications

MaterialsZirconium Rotary Sputtering Target
SymbolZr
Purity99.5% – 99.95%
Theoretical Density (g/cc)6.49
Melting Point (°C)1,852
Production MethodSpraying Type / Monolithic Type (HIP)
Backing TubeTitanium, Stainless Steel
SizeAs per customer’s drawings
Relative Density>= 99%
Grain Sizes< 100 µm
Annual Capacity1000 tons

Applications

  • Flat Panel Display Industry
  • Construction / Automotive Glass Industry
  • Decorative / Functional Coating Industry

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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