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ST0047D Strontium Copper Oxide Sputtering Targets (SrCuO2)

Introduction

Strontium Copper Oxide Sputtering Targets (SrCuO₂) are advanced oxide ceramic materials widely used in the deposition of functional thin films for superconductivity research, oxide electronics, and complex heterostructures. As a key copper-oxide compound, SrCuO₂ plays an important role in high-temperature superconducting systems and correlated electron materials.

In thin film deposition, precise stoichiometry and phase purity are critical. SrCuO₂ sputtering targets are engineered to provide stable composition transfer, enabling reproducible growth of epitaxial or polycrystalline oxide films for research and device development.

Detailed Description

SrCuO₂ is a ternary oxide ceramic typically fabricated through solid-state reaction and high-temperature sintering processes. Strict control of precursor purity, calcination conditions, and sintering atmosphere ensures correct phase formation and minimized secondary phases.

Key characteristics of SrCuO₂ sputtering targets include:

  • Controlled stoichiometric ratio (Sr:Cu = 1:1)

  • High phase purity for superconducting and electronic applications

  • Dense microstructure to reduce particle generation

  • Stable sputtering behavior under RF magnetron systems

Due to its ceramic and insulating nature, SrCuO₂ targets are generally used with RF sputtering. For high-power or long-duration deposition, optional bonding to a copper backing plate improves thermal conductivity and mechanical stability.

The deposited films can exhibit:

  • Strong anisotropic electronic properties

  • Compatibility with perovskite oxide systems

  • Suitability for layered heterostructures

  • High chemical stability under controlled oxygen atmospheres

Reactive oxygen control during deposition is often critical to maintaining proper oxidation states in copper-oxide thin films.

Applications

Strontium Copper Oxide Sputtering Targets are primarily used in:

  • High-temperature superconducting research

  • Oxide electronics and strongly correlated materials

  • Epitaxial thin film growth on single-crystal substrates

  • Multilayer oxide heterostructures

  • Spintronic and quantum material studies

  • Advanced academic and R&D laboratories

SrCuO₂ is frequently integrated with other oxide materials such as La-based or Y-based compounds in complex oxide stacks.

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical FormulaSrCuO₂Defines superconducting oxide composition
Purity99.9% – 99.99%Ensures phase stability and film consistency
Diameter25 – 100 mm (custom)Compatible with research sputtering systems
Thickness3 – 6 mmInfluences lifetime and sputtering uniformity
Density≥ 95% theoreticalReduces particulate contamination
BondingOptional copper backingEnhances thermal management

Custom dimensions and compositions can be supplied based on deposition system requirements.

Comparison with Related Copper Oxide Targets

MaterialKey AdvantageTypical Application
SrCuO₂Layered copper-oxide structureSuperconducting research films
YBa₂Cu₃O₇ (YBCO)High Tc superconductivityHTS thin films
La₂CuO₄Parent compound of cupratesOxide electronics research
CuOSimple copper oxideGeneral oxide coatings

Compared with YBCO, SrCuO₂ often serves as a structural or electronic component in multilayer oxide research rather than as a standalone superconducting film.

FAQ

QuestionAnswer
Is RF sputtering required?Yes, SrCuO₂ is an insulating oxide and typically requires RF magnetron sputtering.
Can the target be bonded?Yes, copper backing plates are available for improved thermal stability.
Is stoichiometry strictly controlled?Yes, phase and composition control are essential during manufacturing.
What substrates are commonly used?SrTiO₃, LaAlO₃, and other perovskite substrates are commonly selected.
Do you provide small-diameter targets for research?Yes, research-scale diameters such as 1″ or 2″ are available.

Packaging

Our Strontium Copper Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Strontium Copper Oxide Sputtering Targets (SrCuO₂) provide a reliable material solution for superconducting thin films, oxide electronics, and advanced research applications. With controlled stoichiometry, high density, and customizable configurations, they support stable deposition and reproducible film performance.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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