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ST0220 Zirconium Nitride Sputtering Target, ZrN

Chemical Formula: ZrN
Catalog Number: ST0220
CAS Number: 25658-42-8
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Zirconium Nitride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Zirconium Nitride Sputtering Target Description

Zirconium Nitride sputtering target from TFM is a nitride ceramic sputtering material with the chemical formula ZrN.

ZirconiumZirconium is a chemical element that originates from the Persian word ‘zargun,’ meaning gold-colored. It was first mentioned in 1789 and observed by H. Klaproth. The element was later isolated and announced by J. Berzelius. The canonical chemical symbol for zirconium is “Zr,” and it is positioned at atomic number 40 on the periodic table, located in Period 5 and Group 4 within the d-block. The relative atomic mass of zirconium is 91.224(2) Dalton, with the number in brackets indicating the uncertainty in measurement.

Related Product: Zirconium Sputtering Target

NitrogenNitrogen is a chemical element that derives its name from the Greek words ‘nitron’ and ‘genes,’ which mean nitre-forming. It was first identified in 1772 by Daniel Rutherford, who is also credited with isolating the element. Nitrogen’s chemical symbol is “N,” and it occupies atomic number 7 on the periodic table. It is situated in Period 2 and Group 15, within the p-block. The relative atomic mass of nitrogen is 14.0067(2) Dalton, with the figure in brackets indicating the uncertainty in this measurement.

Zirconium Nitride Sputtering Target Specification

Material TypeZirconium Nitride
SymbolZrN
Color/AppearanceYellow-brown
Melting Point2980 °C
Density7.09 g/cm3
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Zirconium Nitride Sputtering Target Application

The zirconium nitride sputtering target is primarily utilized in thin film deposition processes. Its applications span various industries, including decoration, semiconductor manufacturing, display technology, LED production, and photovoltaic devices. It is also used for functional coatings in optical information storage, as well as in glass coating industries for car and architectural glass. Additionally, zirconium nitride is beneficial in optical communication technologies.

Zirconium Nitride Sputtering Target Packaging

Our zirconium nitride sputtering targets are meticulously tagged and labeled to ensure clear identification and stringent quality control. We prioritize careful handling and packaging to prevent any damage during storage and transportation, ensuring that our products arrive in pristine condition.

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TFM offers Zirconium Nitride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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