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ST0226 Niobium Carbide Sputtering Target, NbC

Chemical Formula: NbC
Catalog Number: ST0226
CAS Number: 12069-94-2
Purity: >99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Niobium Carbide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Niobium Carbide Sputtering Target Description

Niobium Carbide (NbC) sputtering target, available from TFM, is a carbide ceramic material known for its hardness and thermal conductivity. The compound consists of niobium and carbon, forming a robust material used in various industrial applications. NbC sputtering targets are widely used in thin film deposition processes, which are critical in creating durable and high-performance coatings across a range of sectors, including electronics, aerospace, and tools manufacturing.

niobium

Niobium is a silver-colored metal typically found alongside tantalum. These two elements are often separated through the process of fractional crystallization of their respective fluoro-complexes. Niobium is relatively abundant in the Earth’s crust, present at about 20 parts per million (ppm). As a pure metal, niobium is highly reactive and forms a stable oxide layer when exposed to air, which significantly enhances its corrosion resistance. Additionally, niobium reacts with various non-metals, especially at elevated temperatures, making it a versatile material in various applications, including alloy production and electronics.

Related Product: Niobium Sputtering Target

CarbonCarbon is a chemical element with the symbol “C” and atomic number 6, originating from the Latin word ‘carbo’, meaning charcoal. It has been utilized since as early as 3750 BC, with its use traced back to ancient Egyptians and Sumerians. Carbon is a nonmetal that is essential to all known life forms and is found in abundance in the Earth’s crust. It resides in Period 2 and Group 14 of the periodic table, within the p-block. The relative atomic mass of carbon is 12.0107(8) Dalton, with the number in parentheses indicating the uncertainty in this measurement.

Niobium Carbide Sputtering Target Specification

Compound FormulaNbC
Molecular Weight104.92
AppearanceGray
Melting Point3,490° C
Boiling PointN/A
Density7.82 g/cm3

Niobium Carbide Sputtering Target Application

The niobium carbide sputtering target is primarily used in thin film deposition, offering advanced coatings for a variety of applications. This includes decorative finishes, semiconductor devices, displays, LEDs, and photovoltaic systems. It also serves a vital role in functional coatings for optical information storage, glass coating industries such as automotive and architectural glass, and optical communication technologies. The material’s properties make it suitable for creating durable, high-performance coatings in these sectors.

Niobium Carbide Sputtering Target Packaging

Our niobium carbide sputtering target is meticulously tagged and labeled on the outside to ensure easy identification and maintain stringent quality control standards. We take extensive precautions in packaging and handling to prevent any damage during storage or transportation, ensuring that the product arrives in perfect condition.

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TFM offers Niobium Carbide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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