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ST0272 Barium Sulfide Sputtering Target, BaS

Chemical Formula: BaS
Catalog Number: ST0272
CAS Number: 21109-95-5
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Barium Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

The Barium Sulfide (BaS) Sputtering Target is a specialized compound target used in thin film deposition processes, particularly for advanced optical, electronic, and materials research applications. As an alkaline earth sulfide, barium sulfide exhibits interesting electronic and optical characteristics that make it valuable for semiconductor studies, luminescent materials, and functional thin films.

In Physical Vapor Deposition (PVD) systems such as magnetron sputtering, BaS targets enable the formation of controlled barium sulfide thin films with precise stoichiometry. These films are often explored in optoelectronics, phosphor materials, and semiconductor devices where sulfide compounds provide unique optical and electronic properties.

Detailed Description

Barium Sulfide Sputtering Targets are typically produced using high-purity barium sulfide powder through advanced ceramic processing techniques such as cold pressing, sintering, or hot pressing. These manufacturing methods ensure high density, structural stability, and uniform composition, which are critical for stable sputtering behavior.

BaS is a sulfide ceramic material that requires controlled handling and high-purity processing to maintain consistent chemical composition. During target fabrication, careful control of oxygen exposure and moisture is necessary because alkaline earth sulfides can react with environmental contaminants. As a result, high-purity BaS sputtering targets are often processed and packaged under controlled conditions to maintain material integrity.

Because BaS is an electrically insulating compound, RF magnetron sputtering is generally used for thin film deposition. This method allows stable plasma generation and uniform material transfer from the target to the substrate.

BaS targets can be manufactured in multiple geometries including circular discs, rectangular plates, or custom shapes to match different sputtering cathode configurations. For high-power sputtering systems, the target can also be bonded to a copper backing plate using indium bonding or elastomer bonding to improve heat dissipation and mechanical stability during operation.

High-density BaS targets help reduce particle generation, improve sputtering efficiency, and enable the deposition of smooth, uniform thin films suitable for research and industrial applications.

Applications

Thin films deposited from Barium Sulfide Sputtering Targets are used in a variety of advanced technology and research areas:

  • Optoelectronic materials research – BaS films are investigated for their electronic and optical properties.

  • Luminescent and phosphor materials – barium sulfide compounds are used as host materials in certain phosphor systems.

  • Semiconductor research – sulfide materials are explored for novel semiconductor structures.

  • Optical coatings – BaS thin films can contribute to specialized optical or infrared coatings.

  • Functional thin film development – used in experimental materials science and device fabrication.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Higher purity reduces contamination in thin films
Density≥95% theoreticalHigh density improves sputtering stability
Diameter25 – 300 mm (custom)Compatible with various sputtering systems
Thickness3 – 6 mmInfluences deposition rate and target lifetime
BondingCopper backing plate (optional)Improves heat transfer and operational stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Barium Sulfide (BaS)Stable alkaline-earth sulfide with interesting optical propertiesPhosphor materials and thin film research
Zinc Sulfide (ZnS)Excellent optical transparencyOptical coatings and infrared optics
Calcium Sulfide (CaS)Useful host for luminescent materialsPhosphors and optoelectronic devices

FAQ

QuestionAnswer
Can BaS sputtering targets be customized?Yes, diameter, thickness, purity level, and bonding options can be customized to fit different sputtering systems.
Which sputtering method is recommended for BaS targets?RF magnetron sputtering is typically used for insulating sulfide ceramic targets.
Are bonded targets available?Yes, BaS targets can be indium-bonded or elastomer-bonded to copper backing plates for improved thermal conductivity.
What substrates are compatible with BaS films?Common substrates include silicon wafers, glass, sapphire, and oxide substrates used in research environments.
Which industries use BaS sputtering targets most frequently?Research institutions, semiconductor laboratories, optoelectronics development, and phosphor material research.

Packaging

Our Barium Sulfide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. Each target is carefully vacuum-sealed and packed with protective cushioning materials to prevent contamination or mechanical damage during storage and transportation. Export-safe cartons or wooden crates are used to ensure safe international delivery.

Conclusion

The Barium Sulfide (BaS) Sputtering Target is an important compound material for producing specialized sulfide thin films used in optoelectronics, semiconductor research, and luminescent materials development. Its unique chemical composition and compatibility with RF sputtering processes make it suitable for advanced thin film applications.

With customizable dimensions, high purity levels, and reliable manufacturing methods, BaS sputtering targets provide consistent performance for both research laboratories and industrial deposition systems.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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