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ST0272 Barium Sulfide Sputtering Target, BaS

Chemical Formula: BaS
Catalog Number: ST0272
CAS Number: 21109-95-5
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Barium Sulfide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Barium Sulfide Sputtering Target Description

Barium sulfide sputtering target is a type of sulfide ceramic sputtering target composed of barium and sulfur. This target is utilized in thin film deposition processes, particularly in applications such as decoration, semiconductor manufacturing, display technology, LED and photovoltaic devices, as well as functional coatings. It is also employed in the optical information storage space industry and for glass coating in automotive and architectural applications, enhancing optical communication properties.

Barium

Barium is a soft, silvery alkaline earth metal, and the fifth element in group 2 of the periodic table. Due to its high chemical reactivity, barium is not found as a free element in nature. Its hydroxide, known as baryta in pre-modern times, is not naturally occurring as a mineral but can be synthesized by heating barium carbonate. The most common naturally occurring minerals containing barium are barite (barium sulfate, BaSO₄) and witherite (barium carbonate, BaCO₃), both of which are insoluble in water. The name “barium” comes from the alchemical term “baryta,” derived from the Greek word “βαρύς” (barys), meaning “heavy.”

Related Product: Barium Sputtering Target

SulfurSulfur, also spelled sulphur, is a chemical element with the symbol “S” and atomic number 16. The name sulfur is derived from the Sanskrit word ‘sulvere’ or the Latin ‘sulfurium’, both terms historically used to describe sulfur. This element has been known since ancient times, with evidence of its use dating back to before 2000 BC by Chinese and Indian civilizations. Sulfur is located in Period 3, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 32.065(5) Dalton, with the number in brackets indicating the uncertainty in its measurement.

Barium Sulfide Sputtering Target Application

The barium sulfide sputtering target is commonly used in various high-tech applications, including thin film deposition, decoration, and semiconductor industries. It’s also widely utilized in the manufacturing of displays, LEDs, and photovoltaic devices. Additionally, this material is valuable for functional coatings and is extensively employed in the optical information storage industry, as well as in glass coating for applications like car glass, architectural glass, and optical communications.

Barium Sulfide Sputtering Target Packing

Our barium sulfide sputter targets are meticulously tagged and labeled externally to ensure easy identification and maintain quality control. We take extensive precautions to prevent any potential damage during storage or transportation, ensuring that our products arrive in perfect condition.

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TFM offers Barium Sulfide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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