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ST0402 Planar Molybdenum (Mo) Sputtering Target

Chemical Formula: Mo
Catalog Number: ST0402
CAS Number: 7439-98-7
Purity: 99.95% -99.97%
Thermal Conductivity: 139 W/m.K
Melting Point (°C):  2,617
Coefficient of Thermal Expansion: 4.8 x 10-6/K

 Planar Molybdenum sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Planar Molybdenum Sputtering Target Description

MolybdenumThe Planar Molybdenum Sputtering Target is a series of processed products made from high-purity molybdenum material, designed to have specific sizes and shapes. These targets are primarily used for vacuum coating applications. Molybdenum metal is silvery-white and very hard, with a melting point of 2623°C (4753°F), making it one of the elements with the highest melting points, only surpassed by tantalum, osmium, rhenium, and tungsten among natural elements. Additionally, molybdenum has one of the lowest coefficients of thermal expansion among metals in commercial use.

Related Post: Molybdenum Sputtering Target

Planar Molybdenum (Mo) Sputtering Target Specification

WLTGW
Dimension70”90”1/2”< 450 lbs

Pure molybdenum

Mo >99.95%

Material TypeMolybdenum
SymbolMo
Color/AppearanceGrey, Metallic
Melting Point 2,617 °C
SputterDC
Type of BondIndium, Elastomer
CommentsFilms smooth, hard. Careful degas required.
Density10280 kg/m3
planar targets

Planar Molybdenum (Mo) Sputtering Target Application

The Planar Molybdenum Sputtering Target is widely used in the manufacturing of LCD and touch screens (panels). It is also utilized for solar cells and solar water heating applications. We provide pure molybdenum and molybdenum alloy targets in various shapes, including disc, planar, and rotary, as well as custom targets tailored to specific requirements.

Other Molybdenum Products Compositions

Molybdenum alloy

Mo-Nb (90at% Mo:10at% Nb) Mo-Cr (Mo 97 wt% Mo: 3 wt% Cr)

Molybdenum compounds

Molybdenum Telluride (MoTe2), 99.999%

Molybdenum Selenide (MoSe2), 99.999%

Molybdenum Boride (Mo2B5), 99.5%

Molybdenum Disulfide (MoS2), 99.9%

Molybdenum Silicide (MoSi2), >99.5%

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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