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ST0485 Gold Germanium Sputtering Target, Au/Ge

Chemical Formula: Au/Ge
Catalog Number: ST0485
Purity: 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

 Gold Germanium sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Gold Germanium Sputtering Target Description

GoldGold is a chemical element whose name comes from the Anglo-Saxon word *gold* (from the Latin *aurum*, meaning “glow of sunrise”). It has been used since before 6000 BC and was discovered by ancient peoples in the Middle East. The chemical symbol for gold is “Au,” and it is located in Period 6, Group 11 of the periodic table, within the d-block. Its atomic number is 79, and its relative atomic mass is 196.966569, with the number in brackets indicating the uncertainty.

GermaniumGermanium is a chemical element named after Germany, with the Latin name *Germania*. It was first identified in 1886 by A. Winkler. The chemical symbol for germanium is “Ge.” It is located in Period 4, Group 14 of the periodic table, within the p-block. Its atomic number is 32, and its relative atomic mass is 72.64, with the number in brackets indicating the uncertainty.

Like silicon, germanium is a semiconductor and is commonly used in the production of transistors and integrated circuits. It is frequently evaporated under vacuum conditions to form layers in optical storage media and optical coatings. Additionally, germanium serves as an alloying agent and catalyst in various applications.

Related Products: Gold sputtering target, Germanium sputtering target.

Gold Germanium Sputtering Target Specifications

Material TypeGold Germanium
SymbolAu/Ge
Color/AppearanceSolid
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Gold Germanium Sputtering Target Application

The Gold Germanium Sputtering Target is used in thin film deposition, decoration, semiconductors, displays, LEDs, and photovoltaic devices. It also plays a role in functional coatings, optical information storage, glass coatings (including automotive and architectural glass), and optical communication technologies.

Gold Germanium Sputtering Target Packing

Our Gold Germanium Sputtering Targets are clearly tagged and labeled for efficient identification and quality control. We take great care to prevent any damage during storage and transportation, ensuring the targets remain in optimal condition.

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TFM offers Gold Germanium Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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