Product Overview
Gold Platinum Sputtering Target (Au/Pt) is an alloy sputtering target used to deposit composition-controlled alloy films. Relative to a pure elemental target, the alloying constituents are introduced to tune electrical, magnetic, optical, mechanical, or adhesion-related film properties. For this reason, alloy ratio, homogeneity, purity basis, and the intended film composition should be defined clearly in the procurement specification.
Material and Deposition Characteristics
Many alloy targets are electrically conductive and can be compatible with DC or pulsed-DC magnetron sputtering, subject to the actual alloy composition and equipment capability. The target composition is not always reproduced exactly in the deposited film because preferential sputtering, re-sputtering, substrate heating, and process gas conditions can shift the final ratio. For composition-sensitive work, deposited-film analysis should be part of process qualification.
Technical Data
| Parameter | Typical Value / Range | Importance |
|---|---|---|
| Purity | 99.9% – 99.99% | High purity ensures film performance and reliability |
| Composition (Au:Pt) | 80:20 – 20:80 (custom) | Composition influences conductivity & catalytic activity |
| Diameter | 25 – 300 mm (customizable) | Matches magnetron sputtering system sizes |
| Thickness | 3 – 6 mm | Affects sputtering rate and deposition efficiency |
| Bonding | Copper / Molybdenum backing | Improves heat transfer and mechanical stability |
| Material | Key Advantage | Typical Application |
|---|---|---|
| Gold Platinum (Au-Pt) | Balanced conductivity & stability | Catalysis, optics, electronics |
| Pure Gold (Au) | Highest conductivity, ductility | Microelectronics, decoration |
| Pure Platinum (Pt) | Superior catalytic activity | Fuel cells, chemical sensors |
| Question | Answer |
|---|---|
| Can the Au:Pt ratio be customized? | Yes, alloy composition is adjustable to meet specific electronic or catalytic requirements. |
| How is it packaged? | Each target is vacuum-sealed, protected with foam, and shipped in export-safe cartons or crates. |
| What is the delivery time? | Standard lead time is 3–4 weeks depending on size and composition. |
| Is bonding necessary? | Bonding to copper or molybdenum backing plates is recommended for larger targets to improve thermal management. |
| Which industries use it most? | Semiconductor, optics, catalysis, energy, and decorative coating industries. |
Typical Thin-Film Applications
- Gold Platinum alloy films where composition control is important to electrical, mechanical, magnetic, or optical performance
- Multilayer stacks, adhesion/barrier layers, conductive films, or functional coatings depending on the alloy system
- Research and production programs that require customized alloy ratios and repeatable sputtering behavior
Target Configuration and Ordering Considerations
For quotation and manufacturability review, provide target size, thickness, purity or alloy composition, quantity, and the sputtering gun or cathode model if known. If a bonded assembly is required, include backing-plate material, bonding preference, and any dimensional tolerances, surface-finish needs, or inspection-document requirements. TFM can also review customer drawings or old-target samples for replacement builds.
Frequently Asked Questions
Can the composition of a Gold Platinum sputtering target be customized?
Yes. For alloy targets, the required ratio should be specified clearly in wt% or at%. TFM can review custom compositions together with purity, dimensions, and manufacturability.
Will an alloy target always produce a film with the same composition?
Not necessarily. Preferential sputtering, substrate heating, process gas, and re-sputtering effects can shift the deposited composition relative to the nominal target chemistry. Film analysis should be used when the composition is critical.
Is a Gold Platinum alloy target compatible with DC magnetron sputtering?
Many metallic alloy targets are electrically conductive and can be compatible with DC or pulsed-DC sputtering, but the final choice depends on the actual alloy system and equipment.
Why is alloy homogeneity important in a Gold Platinum target?
A uniform alloy distribution helps support stable erosion and reduces local composition variation across the target, which in turn helps improve run-to-run consistency.
Can a Gold Platinum target be supplied bonded?
Yes. Where the cathode or thermal load requires it, TFM can supply bonded assemblies. Backing-plate material, target thickness, bonding method, and operating power should be reviewed together.
What should I include in an RFQ for Gold Platinum?
Specify the alloy composition, purity basis, dimensions, quantity, backing requirement, cathode model or drawing, and any tolerance, inspection, or documentation requirements.
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