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Nickel Titanium Evaporation Materials

VD0641 Nickel Titanium Evaporation Materials, Ni/Ti

Catalog No.VD0641
MaterialNickel Titanium (Ni/Ti)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a top-tier provider specializing in the production and distribution of high-purity nickel titanium evaporation materials, along with an extensive selection of other evaporation materials. Our offerings include both powder and granule forms, with the flexibility to customize according to specific needs.

MSDS File

Nickel Titanium Evaporation Materials

Introduction

Nickel Titanium evaporation materials are highly valued in thin film deposition for their unique combination of shape memory behavior, mechanical strength, and corrosion resistance. The alloy, commonly known as Nitinol, brings together nickel’s electrical conductivity with titanium’s strength and biocompatibility, making it an ideal choice for advanced coatings in electronics, optics, medical devices, and aerospace applications.

Detailed Description

Nickel Titanium evaporation materials are produced with precise control over composition and purity to achieve stable evaporation performance and consistent film quality. Available in multiple forms such as pellets, pieces, granules, and custom shapes, these materials are optimized for both thermal and electron beam evaporation systems.

  • Purity: Typically available at 99.9% or higher to minimize contamination.

  • Composition: Standard Ni-Ti alloy ratios can be supplied, or customized according to specific thin film requirements.

  • Film Properties: Evaporated Ni-Ti films exhibit excellent adhesion, flexibility, and wear resistance. In certain applications, the films can retain shape memory characteristics, which is particularly useful for functional coatings.

  • Deposition Stability: Controlled density and particle size help prevent spitting, ensuring uniform thin film deposition.

Applications

Nickel Titanium evaporation materials are used in a wide range of industries, including:

  • Semiconductors – diffusion barriers and conductive layers.

  • Optical coatings – protective and decorative films.

  • Medical devices – biocompatible coatings for implants and surgical tools.

  • Aerospace & automotive – thin films with high fatigue resistance.

  • Energy devices – electrode and functional coatings in batteries and smart materials.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%High purity improves film performance
Forms AvailablePellets, pieces, granules, customSuitable for thermal and e-beam systems
Size Range1 – 20 mm (pellets/granules)Affects evaporation uniformity
Evaporation MethodThermal / Electron beamFlexible deposition options
CompositionNi-Ti alloy (customizable)Enables tailoring of shape memory and mechanical properties

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Nickel Titanium (Ni-Ti)Shape memory & biocompatibilityMedical & aerospace coatings
Pure NickelHigh conductivity & ductilityElectronic thin films
Pure TitaniumStrength & corrosion resistanceAerospace & biomedical coatings
Nickel Chromium (Ni-Cr)Oxidation resistanceProtective coatings

FAQ

QuestionAnswer
Can the Ni:Ti ratio be customized?Yes, different Ni-Ti ratios can be supplied to match required thin film properties.
What deposition methods are compatible?Compatible with both thermal and electron beam evaporation.
How are these materials packaged?Vacuum-sealed in inert atmospheres with protective cartons or crates for export.
What industries use Ni-Ti thin films most?Medical, aerospace, electronics, and energy storage.
Do the films retain shape memory effects?In some cases, yes, depending on the alloy composition and processing conditions.

Packaging

Nickel Titanium evaporation materials are vacuum-sealed under inert gas to prevent oxidation and contamination. For export, they are cushioned with protective foam and shipped in reinforced cartons or wooden crates with clear labeling for traceability.

Conclusion

Nickel Titanium evaporation materials provide unique advantages that go beyond conventional alloys, offering shape memory properties, durability, and excellent adhesion in thin film applications. With customizable compositions, purities, and forms, they are a reliable solution for both research and industrial manufacturing.

For detailed specifications and a quotation, please contact us at [sales@thinfilmmaterials.com].

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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