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VD0641 Nickel Titanium Evaporation Materials, Ni/Ti

Catalog No.VD0641
MaterialNickel Titanium (Ni/Ti)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a top-tier provider specializing in the production and distribution of high-purity nickel titanium evaporation materials, along with an extensive selection of other evaporation materials. Our offerings include both powder and granule forms, with the flexibility to customize according to specific needs.

MSDS File

Nickel Titanium Evaporation Materials Overview

TFM’s nickel titanium evaporation materials are high-purity alloys made from nickel (Ni) and titanium (Ti). Essential for high-quality deposition processes, these materials ensure excellent film quality. With a purity level up to 99.9995%, our products are produced under strict quality control measures.

Applications of Nickel Titanium Evaporation Materials

Our nickel titanium evaporation materials are versatile and used in:

  • Deposition Processes: Perfect for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optical Applications: Suitable for wear protection, decorative coatings, and enhancing display technologies.

Packaging and Handling

We take great care in packaging our nickel titanium evaporation materials to preserve their quality and prevent damage during storage and transportation.

Contact TFM

TFM provides nickel titanium evaporation materials in various forms, including tablets, granules, rods, and wires. Custom shapes and quantities are available on request. We also offer additional products such as evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For pricing information or inquiries about other materials, please contact us.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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