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Nickel Zirconium Evaporation Materials

VD0644 Nickel Zirconium Evaporation Materials, Ni/Zr

Catalog No.VD0644
MaterialNickel Zirconium (Ni/Zr)
Purity99.9%
ShapePowder/ Granule/ Custom-made

Thin-Film Mat Engineering (TFM) stands out as a premier producer and distributor of high-purity nickel zirconium evaporation materials. Our extensive range includes both powder and granule forms of evaporation materials, with customization options available to meet specific needs.

MSDS File

Introduction

Nickel Zirconium (Ni/Zr) Evaporation Materials are alloy-based sources developed for controlled thin film deposition in physical vapor deposition (PVD) systems. By combining nickel’s excellent electrical conductivity and corrosion resistance with zirconium’s strong chemical reactivity and adhesion-promoting characteristics, Ni/Zr alloys enable functional coatings with enhanced mechanical and interfacial performance. These materials are widely used in electronics, barrier layers, and advanced metallurgical research.

Detailed Description

Our Nickel Zirconium Evaporation Materials are produced from high-purity nickel and zirconium through controlled alloying processes to ensure compositional uniformity and stable evaporation behavior. Precise Ni-to-Zr ratios can be tailored to achieve specific film properties, such as improved adhesion, diffusion resistance, or mechanical strength.

The alloy is supplied in forms suitable for thermal evaporation or electron-beam evaporation, including granules, pellets, and custom-cut pieces. Uniform particle size distribution supports stable evaporation rates and minimizes spitting during heating. Strict impurity control helps maintain film purity, particularly in applications requiring low oxygen or metallic contamination. Customized packaging and sizing options are available to match various crucible and source configurations.

Applications

Nickel Zirconium Evaporation Materials are commonly used in:

  • Adhesion and barrier layers in microelectronics

  • Diffusion-resistant interlayers

  • Corrosion-resistant and wear-resistant thin films

  • Functional coatings in vacuum systems

  • Alloy thin film research and materials development

  • R&D in energy and advanced manufacturing sectors

Technical Parameters

ParameterTypical Value / RangeImportance
Chemical CompositionNi/Zr alloy (custom ratios)Controls adhesion and barrier properties
Purity99.9% – 99.99%Reduces contamination in films
FormPellets / Granules / CustomCompatible with evaporation sources
Particle Size1 – 6 mm (custom available)Ensures stable evaporation behavior
Evaporation MethodThermal / E-beamMatches PVD systems
Melting BehaviorAlloy-dependentInfluences evaporation stability

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Ni/ZrBalanced conductivity & adhesionBarrier & functional films
Pure NickelExcellent conductivityContact layers
Pure ZirconiumStrong adhesion & reactivityGetter & interface layers
Ni/Cr AlloyCorrosion resistanceProtective coatings

FAQ

QuestionAnswer
Can the Ni/Zr ratio be customized?Yes, alloy composition can be tailored to meet specific application requirements.
Which evaporation method is recommended?Both thermal and electron-beam evaporation are suitable depending on system configuration.
How is evaporation stability maintained?Controlled particle size and alloy homogeneity ensure consistent deposition rates.
How is the material packaged?Vacuum-sealed or inert-gas packed to prevent oxidation.

Packaging

Our Nickel Zirconium Evaporation Materials are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the materials arrive in excellent condition.

Conclusion

Nickel Zirconium (Ni/Zr) Evaporation Materials provide a reliable and customizable solution for depositing alloy thin films with improved adhesion, diffusion resistance, and corrosion performance. With controlled composition, high purity, and flexible forms, Ni/Zr materials are well suited for advanced electronic, structural, and research applications.
For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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