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Terbium(III) Fluoride Evaporation Materials

VD0791 Terbium(III) Fluoride Evaporation Materials, TbF3

Catalog No.VD0791
MaterialTerbium Fluoride (TbF3)
Purity99.9%
ShapePowder/ Granule/ Custom-made

TFM is a premier manufacturer and supplier of high-purity terbium(III) fluoride evaporation materials, along with a wide selection of other evaporation materials. Our terbium(III) fluoride products are available in both powder and granule forms, with options for custom shapes and specifications to meet your unique requirements.

MSDS File
Terbium(III) Fluoride Evaporation Materials Overview

TFM offers high-purity terbium(III) fluoride (TbF3) evaporation materials, a key component in achieving superior quality in thin-film deposition processes. Known for their chemical formula TbF3, these fluoride ceramic materials are critical for applications requiring precise and reliable film deposition. With purity levels reaching up to 99.9995%, TFM ensures the highest standard of quality through rigorous quality assurance procedures.

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Terbium(III) Fluoride Evaporation Materials Specification

Material TypeTerbium(III) Fluoride
SymbolTbF3
Appearance/ColorWhite solid
Melting Point1172℃
Molar Mass215.92
Purity99.9%
ShapePowder/ Granule/ Custom-made

Applications for Terbium(III) Fluoride

Terbium(III) fluoride is used extensively in various deposition processes such as semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). These materials are particularly valued in optical applications, including wear-resistant coatings, decorative layers, and display technologies.

Packaging and Handling

TFM prioritizes the careful labeling and packaging of terbium(III) fluoride evaporation materials to facilitate easy identification and maintain quality. Measures are in place to protect the materials from damage during storage and transportation.

Contact TFM for Customized Orders

TFM is a leading provider of high-purity terbium(III) fluoride evaporation materials, available in various forms including tablets, granules, rods, and wires. We also offer custom shapes and quantities upon request. Additionally, TFM supplies a range of related products such as evaporation sources, filaments, crucibles, and e-beam crucible liners. For pricing inquiries or information on other materials, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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