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VD0810A AgInTe2 Pellet Evaporation Material (AgInTe2)

MSDS File
Material TypeAgInTe2
SymbolAgInTe2
Melting Point (°C)
Theoretical Density (g/cc)
Z Ratio
E-Beam
E-Beam Crucible Liner Material
Temp. (°C) for Given Vap. Press. (Torr)
Comments

AgInTe2 Pellet Evaporation Material

TFM provides high-purity AgInTe2 Pellet Evaporation Material, engineered for thin-film deposition in advanced semiconductor, optoelectronic, and thermoelectric applications. This material, composed of silver (Ag), indium (In), and tellurium (Te), is known for its excellent electrical conductivity, infrared absorption, and thermoelectric properties, making it a crucial material for next-generation device fabrication.

Designed for use in thermal evaporation and electron beam (E-beam) evaporation, AgInTe2 Pellet Evaporation Material ensures high-density film formation with exceptional uniformity, superior adhesion, and low impurity levels.

Key Features and Advantages

  • High Purity & Precise Composition: Maintains an optimized AgInTe2 phase, ensuring superior film quality for semiconductor and optical applications.

  • Excellent Electrical & Thermoelectric Properties: Features high carrier mobility and a well-controlled Seebeck coefficient, making it ideal for energy conversion and sensor applications.

  • Strong Infrared Absorption: Enables its application in infrared (IR) detectors, thermal imaging systems, and optical communication devices.

  • Uniform & Defect-Free Film Deposition: Ensures smooth, high-density thin films with strong substrate adhesion, enhancing device reliability.

  • Stable Thermal & Chemical Behavior: Maintains structural integrity under high-temperature processing conditions, ensuring long-term stability in demanding environments.

Applications

  • Infrared Detectors & Sensors: Essential for thermal imaging cameras, IR photodetectors, and optical sensors in aerospace and defense industries.

  • Thermoelectric Power Generation: Plays a critical role in waste heat recovery and energy harvesting applications.

  • Semiconductor & Photovoltaic Devices: Utilized in solar cells, optoelectronic components, and next-generation semiconductors.

  • Thin-Film Transistors (TFTs): Supports advanced circuit designs with stable electrical performance.

Industry Impact and Customization

TFM’s AgInTe2 Pellet Evaporation Material supports innovations in thin-film deposition technology, offering customized material properties to meet specific industry requirements. Our precision manufacturing process allows for optimized film density, stoichiometry, and deposition control, ensuring superior performance in infrared imaging, thermoelectric applications, and semiconductor devices.

With its exceptional electrical, optical, and thermal properties, TFM’s AgInTe2 Pellet Evaporation Material is a vital component for cutting-edge thin-film coatings, providing high reliability and performance across multiple high-tech industries.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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