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ST0290 Aluminum Boride Sputtering Target, AlB2

Chemical Formula: AlB2
Catalog Number: ST0290
CAS Number: 12041-50-8
Purity: 99.5%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Aluminum Boride sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

 

 

MSDS File

Aluminum Boride Sputtering Target Description

An Aluminum Boride Sputtering Target is a type of ceramic material made from aluminum and boron, commonly used in sputtering processes. This material is employed in various applications, including thin film deposition, due to its unique properties and composition.

Aluminium

Aluminium, also known as aluminum, is a chemical element with the symbol “Al” and an atomic number of 13. The name originates from the Latin word ‘alumen,’ meaning bitter salt. Aluminium was first mentioned in 1825 and observed by the scientist Hans Christian Ørsted, who later achieved its isolation and formally announced the discovery. It is situated in Period 3 and Group 13 of the periodic table, belonging to the p-block of elements. The relative atomic mass of aluminium is approximately 26.9815386 Daltons, with the number in parentheses indicating a margin of uncertainty.

Related Product: Aluminium Sputtering Target

BoronBoron is a chemical element with the symbol “B” and an atomic number of 5. The name boron comes from the Arabic word ‘buraq,’ which referred to borax. It was first identified in 1808 by chemists Louis-Joseph Gay-Lussac and Louis-Jacques Thénard, and the element was later isolated by Sir Humphry Davy. Boron is located in Period 2 and Group 13 of the periodic table, classified under the p-block of elements. The relative atomic mass of boron is approximately 10.811 Daltons, with the number in parentheses indicating a margin of uncertainty.

Aluminum Boride Sputtering Target Application

The Aluminum Boride Sputtering Target is utilized in a wide range of applications, including thin film deposition, decorative coatings, and the semiconductor industry. It is also employed in the production of displays, LEDs, and photovoltaic devices, as well as functional coatings. Additionally, this material is valuable in the optical information storage industry, glass coating for automotive and architectural purposes, and optical communication technologies.

Aluminum Boride Sputtering Target Packing

Our Aluminum Boride Sputtering Targets are clearly tagged and labeled on the outside to ensure easy identification and uphold quality control standards. We take extensive precautions to prevent any potential damage during storage and transportation, ensuring the products arrive in optimal condition.

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TFM offers Aluminum Boride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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