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Aluminum Copper Sputtering Target

ST0062 Aluminum Copper Sputtering Target, Al/Cu

Chemical Formula: Al/Cu
Catalog Number: ST0062
CAS Number: 12004-15-8
Purity: 99.9%, 99.95%, 99.99%, 99.995%, 99.999%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Aluminum Copper sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Aluminum Copper Sputtering Target Description

AluminumCopper

The aluminum copper sputtering target is made of high-quality aluminum copper alloys. These alloys are most valued for their higher strength and corrosion resistance compared to other bronze alloys. They are tarnish-resistant and exhibit low rates of corrosion in atmospheric conditions, low oxidation rates at high temperatures, and low reactivity with sulfurous compounds and other exhaust products of combustion. Additionally, they are resistant to corrosion in seawater.

The corrosion resistance of aluminum copper alloys results from the aluminum content, which reacts with atmospheric oxygen to form a thin, tough surface layer of alumina (aluminum oxide). This layer acts as a barrier, protecting the copper-rich alloy from further corrosion.

Related Product: Aluminum Sputtering Target, Copper Sputtering Target

Aluminum Copper Sputtering Target Specification

Compound FormulaAl/Cu
AppearanceReddish metallic target
Melting Point548 °C
Exact Mass89.911 g/mol
Monoisotopic Mass89.911 g/mol
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 6.0″
Thick: 0.125″, 0.250″

We also offer other customized shapes and sizes of the sputtering targets; please Contact Us for more information.

Aluminum Copper Sputtering Target Bonding Services

Specialized bonding services for Aluminum Copper Sputtering Targets, including indium and elastomeric bonding techniques, enhance performance and durability. Thin Film Materials (TFM) ensures high-quality solutions that meet industry standards and customer needs.

We also offer custom machining of backing plates, which is essential for sputtering target assembly. This comprehensive approach improves target design flexibility and performance in thin film deposition. Our channels provide detailed information about bonding materials, methods, and services, helping clients make informed decisions.

Aluminum Copper Sputtering Target Packing

Our metal alloy aluminum copper sputtering targets are clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage that might be caused during storage or transportation.

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TFM offers Aluminum Copper Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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