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VD0772 Aluminum Fluoride Evaporation Materials, AlF3

Catalog No.VD0772
MaterialAluminum Fluiride (AlF3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM is a top manufacturer and supplier of high-purity Aluminum Fluoride evaporation materials, along with an extensive selection of other evaporation solutions. Our Aluminum Fluoride materials are available in both powder and granule forms, with the flexibility to create custom forms based on your specific needs. We are committed to delivering premium-quality materials for a variety of applications, ensuring your project’s success.

MSDS File

Aluminum Fluoride Evaporation Materials Overview

Aluminum Fluoride (AlF3) is a high-purity fluoride ceramic material used extensively in evaporation processes. At TFM, we specialize in producing Aluminum Fluoride evaporation materials with purity levels reaching up to 99.9995%, ensuring high-quality results in deposition processes. Our strict quality assurance procedures guarantee consistent and reliable performance in all applications.

Aluminum Fluoride Evaporation Materials Specification

Material TypeAluminum Fluoride
SymbolAlF3
Appearance/ColorWhite, crystalline solid
Melting Point1,290 °C (2,350 °F; 1,560 K) (anhydrous) (sublimes)
Density3.10 g/cm3 (anhydrous)
2.17 g/cm3 (monohydrate)
1.914 g/cm3 (trihydrate)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications

Aluminum Fluoride evaporation materials serve a wide range of advanced applications, including:

  • Deposition Processes: Suitable for semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD).
  • Optics: Used in wear protection, decorative coatings, and display technologies.

Packaging

TFM carefully labels and tags Aluminum Fluoride evaporation materials to ensure proper identification and maintain strict quality control standards. Each package is designed to prevent damage during storage and transportation, guaranteeing the integrity of the material upon delivery.

Contact Us

As a leading supplier of high-purity Aluminum Fluoride evaporation materials, TFM offers a variety of forms, such as tablets, granules, rods, and wires. Custom shapes and quantities are available upon request. Additionally, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For inquiries about pricing or materials not listed, please feel free to contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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