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ST0208 Aluminum Nitride Sputtering Target, AlN

Chemical Formula: AlN
Catalog Number: ST0208
CAS Number: 24304-00-5
Purity: 99.5%, 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Aluminum Nitride  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Aluminum Nitride Sputtering Target Description

Aluminum Nitride Sputtering Target from TFM is a ceramic sputtering material with the chemical formula AlN.

AluminumAluminum, also known as aluminium, is a chemical element derived from the Latin word ‘alumen,’ meaning bitter salt. It was first identified in 1825 by H.C. Ørsted, who also succeeded in isolating it. The chemical symbol for aluminum is “Al,” and it is located in Period 3, Group 13 of the periodic table, classified within the p-block. Its atomic number is 13, and the relative atomic mass is 26.9815386(8) Dalton, with the figure in brackets representing the measurement’s uncertainty.

Related Product: Aluminum (Al) Sputtering Target

NitrogenNitrogen is a chemical element named after the Greek words ‘nitron’ and ‘genes,’ which mean nitre-forming. It was first identified in 1772 by Daniel Rutherford, who also successfully isolated the element. The chemical symbol for nitrogen is “N.” In the periodic table, nitrogen has an atomic number of 7 and is located in Period 2, Group 15, belonging to the p-block. The relative atomic mass of nitrogen is 14.0067(2) Dalton, with the number in brackets indicating the uncertainty in this measurement.

Aluminum Nitride Sputtering Target Specification

Compound FormulaAlN
AppearanceWhite to pale yellow powder
Melting Point2200 °C
Boiling Point2517 °C
Density2.9 to 3.3 g/cm3
Electrical Resistivity10 to 12 10x Ω-m
Specific Heat780 J/kg-K

Aluminum Nitride Sputtering Target Packaging

Our aluminum nitride sputter targets are meticulously handled to prevent any damage during storage and transportation. This careful handling ensures the products remain in pristine condition, preserving their quality and integrity until they reach their final destination.

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TFM offers Aluminum Nitride Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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