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ST0131 Antimony Doped Tin Oxide Sputtering Target, ATO Sputtering Target

Chemical Formula: ATO
Catalog Number: ST0131
CAS Number: 128221-48-7
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Antimony-Doped Tin Oxide (ATO) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Introduction

Antimony Doped Tin Oxide (ATO) Sputtering Targets are widely used for depositing transparent conductive oxide (TCO) thin films in advanced electronics, optics, and energy technologies. By doping tin oxide (SnO₂) with antimony (Sb), the electrical conductivity of the material is significantly enhanced while maintaining high optical transparency in the visible spectrum.

ATO sputtering targets are commonly used in magnetron sputtering systems to produce transparent conductive coatings for displays, photovoltaic devices, smart windows, and antistatic coatings. These materials offer a cost-effective alternative to other transparent conductive oxides while delivering excellent electrical stability, durability, and environmental resistance.

Detailed Description

Antimony Doped Tin Oxide is a conductive oxide material formed by introducing small amounts of antimony into the tin oxide crystal lattice. In the SnO₂ structure, antimony atoms act as donor dopants, increasing the concentration of free electrons and thereby improving electrical conductivity.

ATO sputtering targets are typically produced through advanced ceramic processing methods such as powder mixing, calcination, pressing, and high-temperature sintering. These manufacturing processes ensure high density, uniform composition, and stable sputtering performance. High-density targets are essential for maintaining consistent sputtering rates and minimizing particle generation during deposition.

The electrical and optical properties of ATO films are strongly influenced by the doping concentration of antimony. Typical Sb doping levels range from 2% to 10%, allowing manufacturers to optimize conductivity and transparency for specific applications. Carefully controlled composition ensures that the deposited thin films maintain high visible light transmission while providing sufficient electrical conductivity.

ATO coatings are particularly valued for their chemical and thermal stability. Compared with other conductive oxides, ATO films offer excellent resistance to oxidation, humidity, and harsh environmental conditions. These properties make them suitable for applications that require long-term stability and durability.

During magnetron sputtering deposition, atoms from the ATO target are ejected from the target surface and deposited onto substrates such as glass, silicon, ceramics, or polymer films. The resulting thin films exhibit high optical transparency, low electrical resistance, and strong adhesion to substrates.

Applications

ATO sputtering targets are widely used in industries requiring transparent conductive coatings and functional thin films. Typical applications include:

  • Transparent conductive coatings for displays and touch panels

  • Photovoltaic and solar cell electrodes

  • Smart windows and electrochromic devices

  • Antistatic coatings for electronic and optical components

  • Gas sensors and environmental monitoring devices

  • Infrared reflective coatings and energy-saving glass

Because of their balanced optical transparency and electrical conductivity, ATO films are widely used in optoelectronic and energy applications.

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% – 99.99%Ensures consistent electrical and optical properties
CompositionSnO₂ doped with Sb (2–10 wt%)Controls conductivity and transparency
Density≥ 95% theoretical densityEnsures stable sputtering performance
Diameter25 – 300 mm (custom)Compatible with various sputtering systems
Thickness3 – 6 mmInfluences sputtering lifetime
BondingCopper / Titanium backing plate optionalImproves heat dissipation during sputtering

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Antimony Doped Tin Oxide (ATO)Stable conductive oxide with good transparencyAntistatic coatings and conductive films
Indium Tin Oxide (ITO)Very high transparency and conductivityDisplays and touch panels
Fluorine Doped Tin Oxide (FTO)Excellent thermal stabilitySolar cells and glass coatings
Aluminum Doped Zinc Oxide (AZO)Indium-free, cost-effective TCOPhotovoltaic devices

FAQ

QuestionAnswer
What is the typical antimony doping level in ATO targets?Typical Sb doping ranges from 2% to 10%, depending on the required conductivity and transparency.
What sputtering methods are suitable for ATO targets?ATO sputtering targets are commonly used in RF magnetron sputtering systems for oxide film deposition.
What substrates are compatible with ATO coatings?Glass, silicon wafers, ceramics, and polymer films are commonly used substrates.
Can ATO sputtering targets be customized?Yes, target size, thickness, composition, and backing plate options can be customized.
What industries commonly use ATO coatings?Electronics, solar energy, display technology, and optical coating industries.

Packaging

Our Antimony Doped Tin Oxide Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain high standards of quality control. We take great care to prevent any potential damage during storage and transportation, ensuring the targets arrive in perfect condition.

Conclusion

Antimony Doped Tin Oxide (ATO) sputtering targets provide an effective solution for producing transparent conductive oxide thin films with excellent electrical conductivity, optical transparency, and environmental stability. Their versatility and cost efficiency make them a valuable material for applications in displays, photovoltaic devices, sensors, and energy-efficient coatings.

With customizable compositions, high-density ceramic targets, and optional backing plate configurations, ATO sputtering targets are suitable for both research-scale experiments and industrial thin film production.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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