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Antimony Doped Tin Oxide Sputtering Target

ST0131 Antimony Doped Tin Oxide Sputtering Target, ATO Sputtering Target

Chemical Formula: ATO
Catalog Number: ST0131
CAS Number: 128221-48-7
Purity: 99.9%, 99.95%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Antimony-Doped Tin Oxide (ATO) sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

ATO Sputtering Target Description

The Antimony-Doped Tin Oxide Sputtering Target (ATO Sputtering Target) from TFM is an oxide sputtering material composed of antimony (Sb), tin (Sn), and oxygen (O).

AntimonyAntimony is a lustrous gray metalloid, primarily found in nature as the sulfide mineral stibnite (Sb2S3). Antimony compounds have been used since ancient times, often powdered for medicinal and cosmetic purposes, commonly known by the Arabic name, kohl. Although metallic antimony was known, it was initially mistaken for lead. The earliest known Western description of antimony was documented in 1540 by Vannoccio Biringuccio. Industrially, antimony is refined through roasting and reduction with carbon or by direct reduction of stibnite using iron.

Related Product: Antimony (Sb) Sputtering Target

TinTin, also known as stannum, is a chemical element whose name originates from the Anglo-Saxon word “tin” and the Latin word “stannum,” meaning hard. It has been in use since around 3500 BC. Tin is represented by the chemical symbol “Sn” and has an atomic number of 50. It is located in Period 5, Group 14 of the periodic table, within the p-block. The relative atomic mass of tin is 118.710(7) Dalton, with the number in brackets indicating the uncertainty.

Related Product: Tin (Sn) Sputtering Target

Oxygen

Oxygen is a chemical element whose name comes from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and its atomic number is 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. The relative atomic mass of oxygen is 15.9994(3) Dalton, with the number in parentheses indicating the uncertainty.

ATO Sputtering Target Application

The Antimony-Doped Tin Oxide (ATO) Sputtering Target is utilized for thin film deposition and a variety of other applications. These include decorative coatings, semiconductor devices, displays, LEDs, and photovoltaic devices. It is also used for functional coatings, optical information storage, glass coatings for automotive and architectural glass, and optical communication systems, among other industries.

ATO Sputtering Target Packing

Our Antimony-Doped Tin Oxide (ATO) Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and maintain strict quality control. We take extensive precautions to prevent any damage during storage and transportation, ensuring the highest standards of product integrity upon delivery.

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TFM offers Antimony-Doped Tin Oxide (ATO) Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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