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antimony-trisulfide-evaporation

VD0810 Antimony Trisulfide Evaporation Materials, Sb2S3

Catalog No.VD0810
MaterialAntimony Sulfide (Sb2S3)
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

TFM stands out as a top-tier manufacturer and supplier specializing in high-purity antimony trisulfide evaporation materials, among a diverse range of other evaporation materials. Our offerings include both powder and granule forms of these materials, with the added flexibility of custom forms tailored to specific needs upon request.

MSDS File

TFM: Antimony Trisulfide Evaporation Materials Overview

Antimony trisulfide, with the chemical formula Sb₂S₃, is a key sulfide ceramic material used in evaporation processes. TFM provides high-purity antimony trisulfide evaporation materials essential for creating high-quality deposited films. Our materials achieve up to 99.9995% purity, ensuring superior performance in various deposition applications. TFM is dedicated to quality assurance processes that ensure the reliability of our products.

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Antimony Trisulfide Evaporation Materials Specification

Material TypeAntimony trisulfide
SymbolSb2S3
Appearance/ColorGrey / black orthorhombic crystal (stibnite)
Melting Point1,150 °C (2,100 °F; 1,420 K)
Density4.562 g/cm3
Purity99.9% ~ 99.99%
ShapePowder/ Granule/ Custom-made

Applications

Antimony trisulfide evaporation materials are widely utilized in various deposition processes, including semiconductor deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD). These materials are primarily used in optics applications such as wear protection, decorative coatings, and display technologies.

Packaging

Our antimony trisulfide evaporation materials are meticulously tagged and labeled for easy identification and quality control. We ensure that our packaging prevents damage during storage and transportation.

Contact Us

TFM is your go-to source for high-purity antimony trisulfide evaporation materials, available in various forms such as tablets, granules, rods, and wires. We also offer customized shapes and quantities to meet specific needs. In addition to evaporation materials, we provide evaporation sources, boats, filaments, crucibles, heaters, and e-beam crucible liners. For current pricing and inquiries about materials not listed, please contact us directly.

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FAQ

  • They are high‐purity substances (e.g. metals, alloys, or compounds) used in thermal or electron‐beam evaporation processes to form thin films on substrates.

  • Typically, they’re processed into a form (often ingots, pellets, or wires) that can be efficiently vaporized. Preparation emphasizes high purity and controlled composition to ensure film quality.

  • Thermal evaporation and electron-beam (e-beam) evaporation are the two main techniques, where material is heated (or bombarded with electrons) until it vaporizes and then condenses on the substrate.

  • Thermal evaporation heats the material directly (often using a resistive heater), while e-beam evaporation uses a focused electron beam to locally heat and vaporize the source material—each method offering different control and energy efficiency.

  • Key parameters include source temperature, vacuum level, deposition rate, substrate temperature, and the distance between the source and the substrate. These factors influence film uniformity, adhesion, and microstructure.

  • Evaporation generally produces high-purity films with excellent control over thickness, and it is especially suitable for materials with relatively low melting points or high vapor pressures.

  • Challenges include issues with step coverage (due to line-of-sight deposition), shadowing effects on complex topographies, and possible re-evaporation of material from the substrate if temperature isn’t properly controlled.

  • Common evaporation materials include noble metals (e.g., gold, silver), semiconductors (e.g., silicon, germanium), metal oxides, and organic compounds—each chosen for its specific optical, electrical, or mechanical properties.

  • Selection depends on desired film properties (conductivity, optical transparency, adhesion), compatibility with the evaporation process, and the final device application (semiconductor, optical coating, etc.).

  • Optimizing substrate temperature, deposition rate, and chamber vacuum are critical for ensuring that the film adheres well and forms the intended microstructure without defects.

  • Troubleshooting may involve checking the source material’s purity, ensuring stable source temperature, verifying the vacuum level, adjusting the substrate’s position or temperature, and monitoring deposition rate fluctuations.

While evaporation tends to yield very high purity films with excellent thickness control, it is limited by its line-of-sight nature. In contrast, sputtering can deposit films more uniformly on complex surfaces and is more versatile for a broader range of materials.

 

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