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ST0957 Barium Bismuth Oxide Sputtering Target, BaBiO3

Chemical FormulaBaBiO3
Catalog No.ST0957
CAS Number–
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Barium Bismuth Oxide sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Barium Bismuth Oxide Sputtering Target Description

The Barium Bismuth Oxide Sputtering Target is a highly specialized component used in the sputtering technique for thin film deposition. During sputtering, high-energy ions bombard the target material, causing it to release atoms. These atoms then settle onto a substrate, forming a thin film with specific desired attributes.

Barium Bismuth Oxide is gaining considerable attention in materials science due to its unique characteristics. Studies have shown that this compound can exhibit superconducting properties, making it a valuable subject for research into superconducting materials. Its ability to conduct electricity with zero resistance at low temperatures highlights its potential for advancements in low-temperature technologies.

Additionally, Barium Bismuth Oxide may also show magnetic properties, thanks to the bismuth content in its composition. This combination of superconducting and magnetic features makes Barium Bismuth Oxide a versatile material with potential applications across various scientific and technological fields.

Related Product: Barium Titanate Sputtering Target, Barium Zirconate Sputtering Target

Barium Bismuth Oxide Sputtering Target Specifications

Compound FormulaBaBiO3
Molecular Weight394.31
AppearanceWhite Target
Melting Point–
Density7.6 g/cm3
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Barium Bismuth Oxide Sputtering Target Handling Notes

For Barium Bismuth Oxide Sputtering Targets, indium bonding is often recommended to address certain challenges related to sputtering. This material, known for its brittleness and low thermal conductivity, can be prone to thermal shock. Indium bonding helps mitigate these issues, enhancing the target’s performance and reliability during the sputtering process.

Barium Bismuth Oxide Sputtering Target Application

Superconducting Electronics: Barium Bismuth Oxide has shown superconducting capabilities in various studies, making it a promising material for creating superconducting electronic devices. These targets are ideal for fabricating superconducting cables, MRI systems, and other applications where superconductivity is crucial.

Optoelectronics: With its unique optical properties, Barium Bismuth Oxide is valuable in the optoelectronics sector. It is used to produce optical components, including photodiodes and lasers, enhancing their performance and efficiency.

Magnetic Materials Research: The presence of bismuth in Barium Bismuth Oxide imparts potential magnetic properties, which are useful in research involving magnetic materials. This includes the development of magnetic memory devices and related technologies.

Electrical Devices: The electrical characteristics of Barium Bismuth Oxide make it suitable for thin film deposition in electrical devices, such as thin film transistors, contributing to advancements in electronic device performance.

Barium Bismuth Oxide Sputtering Target Packaging

Our Barium Bismuth Oxide Sputtering Target is meticulously managed throughout storage and transport to ensure it retains its high-quality standards and remains in optimal condition.

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TFM offers Barium Bismuth Oxide Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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