Thin Film Materials Logo
Generic selectors
Exact matches only
Search in title
Search in content
Post Type Selectors
dewatermark-ai_1723171498370-removebg-preview

ST1012 Barium Carbonate Sputtering Target, BaCO3

Chemical FormulaBaCO3
Catalog No.ST1012
CAS Number513-77-9
Purity99.9%, 99.95%, 99.99%, 99.995%, 99.999%
ShapeDiscs, Plates, Column Targets, Step Targets, Custom-made

Barium Carbonate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Barium Carbonate Sputtering Target Description

Barium Carbonate Sputtering Target is a high-purity material essential for thin film deposition in the semiconductor and optical coating industries. Known for its excellent thermal and chemical stability, this target ensures uniform and precise film deposition. Its high density and purity enable efficient sputtering processes, resulting in high-quality thin films with optimal properties. Suitable for a wide range of applications, including optical coatings, electronic devices, and solar cells, Barium Carbonate Sputtering Target meets stringent requirements, offering reliable performance and consistency. Its versatility supports advancements in technology and materials science.

Related Product: Barium Bismuth Oxide Sputtering Target, Barium Zirconate Sputtering Target

Barium Carbonate Sputtering Target Specifications

Compound FormulaBaCO3
Molecular Weight197.34
AppearanceWhite Target
Melting Point811°C
Density3.89 g/cm³
Available SizesDia.: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

Thick: 0.125″, 0.250″

Barium Carbonate Sputtering Target Handling Notes

Indium bonding is recommended for the Barium Carbonate Sputtering Target due to its inherent characteristics, such as brittleness and low thermal conductivity, which are not ideal for sputtering. The material’s low thermal conductivity and susceptibility to thermal shock make it necessary to use indium bonding to ensure stability and efficient sputtering performance.

Barium Carbonate Sputtering Target Application

  • Semiconductor Industry: Essential for fabricating integrated circuits, microchips, and other electronic devices requiring precise thin film coatings.
  • Optical Coating Industry: Used in producing optical coatings for lenses, mirrors, and other components in cameras, telescopes, and lasers.
  • Solar Cell Manufacturing: Facilitates the deposition of thin film layers in photovoltaic cells to improve light absorption and energy conversion efficiency.
  • Display Technology: Applied in creating thin film layers for flat-panel displays, including LCDs and OLEDs, ensuring high-quality and uniform coatings.

Barium Carbonate Sputtering Target Packaging

Our Barium Carbonate Sputtering Target is meticulously handled during storage and transportation to maintain its quality and ensure it reaches you in optimal condition.

Get Contact

TFM offers Barium Carbonate Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

Reviews

There are no reviews yet.

Be the first to review “ST1012 Barium Carbonate Sputtering Target, BaCO3”

Your email address will not be published. Required fields are marked *

Related Products

Related products

FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
Shopping Cart
Scroll to Top