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Barium Cerium Yttrium Zirconate Sputtering Target

ST0425 Barium Cerium Yttrium Zirconate Sputtering Target, BZCY

Chemical Formula: BaCe(1-x-y)Y(x)Zr(y)O3
Catalog Number: ST0425
Purity: 99.9%, 99.99%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Barium Cerium Yttrium Zirconate sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

Barium Cerium Yttrium Zirconate Sputtering Target – High Purity for Advanced Thin Film Deposition

TFM proudly offers Barium Cerium Yttrium Zirconate Sputtering Targets, engineered for high-performance thin film deposition processes such as RF and DC sputtering. With a chemical composition of BaCe(1-x-y)Y(x)Zr(y)O₃, commonly referred to as BZCY, this complex oxide ceramic material delivers excellent ionic conductivity, thermal stability, and compatibility for semiconductor, optical, and solid oxide fuel cell (SOFC) applications.

We manufacture BZCY sputtering targets with exceptional purity levels up to 99.9995%, ensuring film uniformity, reduced contamination, and improved process yields across demanding PVD/CVD systems.

Key Features of BZCY Sputtering Target

  • Chemical Formula: BaCe(1-x-y)Y(x)Zr(y)O₃

  • Synonyms: BCZY, BZCY721, BZCY72, Ceria- and Yttria-substituted Barium Zirconate

  • Appearance: Dense, solid ceramic material

  • Purity: Up to 99.9995% (5N5)

  • Sputtering Compatibility: RF, DC magnetron sputtering

  • Bonding Options: Elastomer or Indium bonding available for improved thermal contact

  • Applications: Thin film solid electrolytes, proton-conducting membranes, high-k dielectrics, transparent conductive oxides

Standard and Custom Sizes Available

We provide a wide range of standard sizes and also accommodate custom requests:

  • Diameter Options: 1.0″, 2.0″, 3.0″, 4.0″, 5.0″, 6.0″

  • Thickness Options: 0.125″, 0.250″

  • Shapes: Circular, rectangular, or custom machined shapes available upon request

TFM can machine BZCY sputtering targets to fit your specific deposition equipment and application needs. Contact us to discuss your customized requirements.

Packaging and Handling

To maintain product integrity, each Barium Cerium Yttrium Zirconate Sputtering Target is:

  • Individually sealed in anti-static and vacuum-safe packaging

  • Handled in a clean environment to prevent particulate contamination

  • Protected using soft foam and rigid boxes to prevent mechanical damage during transit

Our packaging process ensures that every target arrives in pristine condition, ready for immediate use in vacuum deposition systems.

Applications of BZCY Sputtering Targets

Thanks to its excellent thermal and ionic properties, BZCY is widely used in:

  • Proton-conducting fuel cell membranes (PCFC, SOFC)

  • High-temperature electrochemical devices

  • Semiconductors and electronic ceramics

  • Optical coatings and dielectric films

  • Research and development in advanced materials

The combination of cerium, yttrium, and zirconium in the barium oxide matrix results in improved mechanical strength, reduced electronic leakage, and high conductivity under humid environments.

Why Choose TFM for Your BZCY Targets?

  • High Purity Guarantee: Up to 99.9995% for clean, defect-free film deposition

  • Consistent Microstructure: Low grain size and uniform density ensure reproducible results

  • Customization Expertise: Tailored solutions for your specific sputtering system

  • Comprehensive Inventory: In-stock standard sizes with fast delivery options

  • Global Delivery: Secure worldwide shipping with full documentation and MSDS

Related Products

You may also be interested in:

  • [Barium Sputtering Target]

  • [Cerium Sputtering Target]

  • [Yttrium Sputtering Target]

  • [Zirconium Sputtering Target]

Each elemental component is also available as a standalone sputtering target for alloy tuning and layered deposition strategies.

Request a Quote or Contact Our Technical Team

Whether you’re engaged in materials R&D or high-volume production, TFM offers top-tier Barium Cerium Yttrium Zirconate Sputtering Targets to support your process. Contact us today for pricing, technical data sheets, and bonding services.

📧 Email: sales@thinfilmmaterials.com
📞 Tel: (786) 825-8645
🌐 Website: www.thinfilmmaterials.com

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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