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Barium Oxide Sputtering Target

ST0003A Barium Oxide Sputtering Targets

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Barium Oxide Sputtering Target (BaO)

Introduction

Barium Oxide (BaO) Sputtering Targets are key materials in thin film deposition, widely applied in advanced electronics, optics, and energy devices. Their high purity and stable physical properties enable uniform thin films with excellent dielectric behavior, making them an essential choice for semiconductor manufacturing and research laboratories.

Detailed Description

Our Barium Oxide Sputtering Targets are manufactured from refined BaO powders using advanced pressing and sintering techniques. This process ensures high density, stable structure, and consistent sputtering results.

  • Purity: 99.9% (3N) standard, with higher grades available on request

  • Shapes: Circular, rectangular, and custom-designed targets

  • Bonding Options: Indium, elastomer, or copper backing plates for enhanced thermal conductivity and target stability

With a melting point of 1,923 °C and a theoretical density of 5.72 g/cc, BaO targets deliver reliable deposition under both RF and DC sputtering systems.

Applications

Barium Oxide Sputtering Targets are used in:

  • CMOS and semiconductor devices

  • Gate dielectric and insulating layers

  • Ferroelectric thin films for memory and capacitors

  • Optical coatings for displays, sensors, and glass products

  • Academic and industrial R&D projects

Technical Parameters

ParameterTypical Value / RangeImportance
Purity99.9% (3N)Ensures clean film growth with minimal impurities
Diameter25 – 300 mm (customizable)Fits different sputtering system holders
Thickness3 – 6 mmAffects sputtering efficiency and deposition rate
BondingIndium, Elastomer, CopperEnhances heat transfer and stability
Density5.72 g/cc (theoretical)Provides stable sputtering performance
Melting Point1,923 °CSuitable for high-temperature processes

Comparison with Related Materials

MaterialKey AdvantageTypical Application
Barium Oxide (BaO)High dielectric constantSemiconductors, optical coatings
Strontium Oxide (SrO)Good stability, lower reactivityDielectric layers
Calcium Oxide (CaO)Cost-effective, easy to handleGeneral thin film research

Frequently Asked Questions (FAQ)

QuestionAnswer
Can I order customized targets?Yes, dimensions, purity, and bonding options can be tailored.
What is the delivery time?Standard lead time is 2–3 weeks depending on size and quantity.
How are the targets packaged?Vacuum-sealed, with protective foam in export-safe cartons or wooden crates.
Which industries use BaO targets?Mainly semiconductor, optics, energy, aerospace, and university labs.

Conclusion

Barium Oxide Sputtering Targets provide reliable thin film performance with high dielectric strength and stable deposition. With strict quality control and customizable options, they meet the demands of both research institutions and industrial users.

For detailed specifications and a quotation, please contact us at sales@thinfilmmaterials.com.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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