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ST0003A Barium Oxide Sputtering Targets

MSDS File

Barium Oxide Sputtering Targets

Material Properties

  • Material Type: Barium Oxide (BaO)
  • Color/Appearance: White, Crystalline Solid
  • Melting Point: 1,923°C
  • Theoretical Density: 5.72 g/cc
  • Solubility in Water (20°C): 3.48 g/100mL
  • Sputter Types: RF, DC
  • Maximum Power Density: Please inquire for specific limits.
  • Bonding Types: Indium, Elastomer

Specifications

  • Purity: 99.9%
  • Circular: Diameter ≤ 14 inches, Thickness ≥ 1 mm
  • Block: Length ≤ 32 inches, Width ≤ 12 inches, Thickness ≥ 1 mm

Applications

  • Ferroelectric Materials
  • Gate Dielectric Layers
  • CMOS (Complementary Metal-Oxide-Semiconductor)

Features

  • High Purity: Ensures quality thin-film deposition with excellent uniformity.
  • Custom Sizes: Available to meet your specific needs, including for research and development applications.

Manufacturing Process

  • Cold Pressed & Sintered: Our Barium Oxide targets are made using cold pressing and sintering techniques for optimal performance.
  • Elastomer Bonding: Bonds are created with elastomer materials to ensure durability and stability.
  • Cleaning & Packaging: Thorough cleaning and vacuum-ready packaging to prevent contamination and protect during shipment.

Available Options

  • 99.9% Minimum Purity
  • Smaller Sizes: Custom sizes available for R&D or specialized applications.
  • Target Bonding Service: In-house bonding options, including elastomer bonding for enhanced target reliability.

For more details or to inquire about our Barium Oxide Sputtering Targets, please contact us.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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