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Barium Zirconate Sputtering Target

ST0134 Barium Zirconate Sputtering Target, BaZrO3

Chemical Formula: BaZrO3
Catalog Number: ST0134
CAS Number: 12009-21-1
Purity: 99.9%
Shape: Discs, Plates, Column Targets, Step Targets, Custom-made

Barium Zirconate  sputtering target  come in various forms, purities, sizes, and prices. Thin Film Materials (TFM) manufactures and supplies top-quality sputtering targets at competitive prices.

MSDS File

Barium Zirconate Sputtering Target Description

The Barium Zirconate Sputtering Target from TFM is an oxide sputtering material with the chemical formula BaZrO3.

BariumBarium is the fifth element in group 2 of the periodic table and is characterized as a soft, silvery alkaline earth metal. Due to its high chemical reactivity, barium is never found in nature as a free element. Historically known as baryta, barium hydroxide does not occur naturally as a mineral but can be produced by heating barium carbonate. The most common naturally occurring minerals of barium are barite (barium sulfate, BaSO4) and witherite (barium carbonate, BaCO3), both of which are insoluble in water. The name barium is derived from the alchemical term “baryta,” originating from the Greek word βαρύς (barys), meaning “heavy.”

Related Product: Barium (Ba) Sputtering Target

ZirconiumZirconium is a chemical element named after the Persian word ‘zargun,’ which means ‘gold colored.’ It was first mentioned in 1789 and observed by H. Klaproth. The element was later isolated and announced by J. Berzelius. Zirconium is represented by the chemical symbol “Zr” and has an atomic number of 40. It is located in Period 5, Group 4 of the periodic table, within the d-block. The relative atomic mass of zirconium is 91.224(2) Dalton, with the number in parentheses indicating the measurement uncertainty.

Related Product: Zirconium (Zr) Sputtering Target

OxygenOxygen is a chemical element whose name is derived from the Greek words ‘oxy’ and ‘genes,’ meaning acid-forming. It was first mentioned and observed by W. Scheele in 1771, who also later accomplished and announced its isolation. The chemical symbol for oxygen is “O,” and its atomic number is 8. Oxygen is located in Period 2, Group 16 of the periodic table, within the p-block. Its relative atomic mass is 15.9994(3) Dalton, with the number in parentheses indicating the uncertainty of the measurement.

Barium Zirconate Sputtering Target Specification

Material TypeBarium Zirconate
SymbolBaZrO3
Color/AppearanceOff-white Target
Melting Point/
Density5.52 g/cm3
Available SizesDia.: 2.0″, 3.0″, 4.0″, 5.0″, 6.0″
Thick: 0.125″, 0.250″

Barium Zirconate Sputtering Target Handling Notes

1. Indium bonding is recommended for the BaZrO3 sputter target due to its characteristics such as brittleness and low thermal conductivity, which make it less suitable for traditional sputtering methods.

2. This material has low thermal conductivity and is susceptible to thermal shock.

Barium Zirconate Sputtering Target Application

The Barium Zirconate Sputtering Target is used for various applications, including thin film deposition, decorative coatings, semiconductors, displays, LEDs, and photovoltaic devices. It is also essential for functional coatings, the optical information storage industry, glass coatings for automotive and architectural applications, and optical communication systems, among other fields.

Barium Zirconate Sputtering Target Packing

Our Barium Zirconate Sputtering Targets are meticulously tagged and labeled externally to ensure efficient identification and stringent quality control. We take extensive precautions to prevent any damage during storage and transportation, ensuring the highest standards of product integrity upon delivery.

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TFM offers Barium Zirconate  Sputtering Targets in various forms, purities, sizes, and prices. We specialize in high-purity thin film deposition materials with optimal density and minimal grain sizes, which are ideal for semiconductor, CVD, and PVD applications in display and optics. Contact Us for current pricing on sputtering targets and other deposition materials that are not listed.

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FAQ

It’s the source material (in solid form) used in sputter deposition to eject atoms or molecules that then form a thin film on a substrate.

Targets can be pure metals (e.g., gold, copper, aluminum), ceramics (e.g., Al₂O₃, SiO₂, TiO₂), alloys, or composites—chosen based on the film’s desired properties.

 

They are produced by processes such as melting/casting for metals or sintering (often with hot isostatic pressing) for ceramics and composite targets to ensure high density and purity.

 

In a vacuum chamber, a plasma (typically argon) bombards the target, ejecting atoms that travel and condense on a substrate, forming a thin film.

 

Key factors include the target’s purity, density, grain structure, and the sputtering yield (i.e. how many atoms are ejected per incident ion), as well as operating conditions like power density and gas pressure.

 

Operators monitor target erosion (often by measuring the depth of the eroded “race track”) or track total energy delivered (kilowatt-hours) until it reaches a threshold that can compromise film quality.

 

Fragile materials (such as many ceramics or certain oxides) and precious metals often require a backing plate to improve cooling, mechanical stability, and to allow thinner targets that reduce material costs.

 

DC sputtering is used for conductive targets, while RF sputtering is necessary for insulating targets (like many oxides) because it prevents charge buildup on the target’s surface.

 

In reactive sputtering, a reactive gas (e.g., oxygen or nitrogen) is introduced to form compound films on the substrate, but it may also “poison” the target surface if not carefully controlled.

 

Many manufacturers prefer to control raw material quality by sourcing their own powders; using external powders can risk impurities and inconsistent target properties.

 

Targets should be stored in clean, dry conditions (often in original packaging or re-wrapped in protective materials) and handled with gloves to avoid contamination, ensuring optimal performance during deposition.

Deposition rate depends on factors such as target material and composition, power density, working gas pressure, substrate distance, and the configuration of the sputtering system (e.g., magnetron design).

 
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